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Professor Supervisor of Doctorate Candidates Supervisor of Master's Candidates

Paper Publications

[21]Ren, Jing, Huang, Mingliang, Yang, Xudong.Effect of Ag element on microstructure and mechanical properties of Sn-Bi-xAg solders designed ...[A],2018,265-269
[22]Huang, M. L., Zou, L., Yin, S. Q..Electromigration Behavior and Mechanical Properties of the Whole Preferred Orientation Intermet...[A],2018,2018-May:2041-2048
[23]Guo, Bingfeng, Kunwar, Anil, Jiang, Chengrong, Zhao, Ning, Sun, Junhao, Chen, Jun, Wang, Yunpeng, Ma, Haitao, Huang, Mingliang, N, Ma, HT (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Synchrotron radiation imaging study on the rapid IMC growth of Sn-xAg solders with Cu and Ni su...[J],JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2018,29(1):589-601
[24]A. Nylander, Y.F. Fu, 黄明亮, J. Liu.Covalent anchoring of carbon nanotube based thermal interface materials using epoxy silane monola...[J],IEEE Transaction on Components,2018,6(1):1-8
[25]黄明亮, 邹林, 尹斯奇.Electromigration behavior and mechanical properties of the whole preferred orientation intermetal...[A],2018,2035-2042
[26]Lv, Qipeng, Huang, Mingliang, Deng, Songwen, Zhang, Shaoqian, Li, Gang, ML (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China., Li, G (reprint author), Chinese Acad Sci, Dalian Inst Chem Phys, Key Lab Chem Lasers, Dalian 116023.Effects of oxygen flows on optical properties, micro-structure and residual stress of Ta2O5 fil...[J],OPTIK,2018,166:278-284
[27]Yin, Siqi, Huang, Mingliang, Chen, Yu.Effect of In addition on the properties of Sn-Au-Cu lead-free solder[A],2018,1363-1367
[28]Kuang, Jiameng, Huang, Mingliang.Effect of Soldering Sequences on Cu-Ni interaction in flip-chip interconnects[A],2018,1368-1371
[29]Ma, Haitao, Haoran, Kunwar, Anil, Shang, Shengyan, Wang, Yunpeng, Chen, Jun, Huang, Mingliang, Zhao, Ning, HT, Zhao, N (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Effect of initial Cu concentration on the IMC size and grain aspect ratio in Sn-xCu solders dur...[J],JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2018,29(1):602-613
[30]A. Kunwar, 马浩然, 马海涛, J.H. Sun, 赵宁, 黄明亮.Corrigendum to “On the increase of intermetallic compound's thickness at the cold side in liquid...[J],Materials Letter,2018,230:76-76

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