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Professor Supervisor of Doctorate Candidates Supervisor of Master's Candidates

Paper Publications

[181]Pan, Jianling, Huang, Mingliang, Song.Effects of Plating Parameters on the Au-Sn Co-electrodepositon for Flip Chip-LED Bumps[A],2011,1111-1115
[182]Ye, Song, Huang, Mingliang, Chen, Leida, Zhou, Shaoming.Failure mechanisms of Ni/Sn3.0Ag0.5Cu/OSP flip chip solder under high current stressing[A],2011,584-588
[183]Huang, M. L., Y. Z., Ma, H. T., Zhao, J., ML (reprint author), Dalian Univ Technol, Elect Packaging Mat Lab, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Mechanical Properties and Electrochemical Corrosion Behavior of Al/Sn-9Zn-xAg/Cu Joints[J],JOURNAL OF ELECTRONIC MATERIALS,2011,40(3):315-323
[184]Huang, M. L., Liu, Y., Gao, J. X., ML (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Elect Packaging Mat Lab, Dalian 116024, Peoples R China..Interfacial reaction between Au and Sn films electroplated for LED bumps[J],JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2011,22(2):193-199
[185]黄明亮.Effect of Interfacial Reaction on Reliability of Flip Chip Lead-free Solder Joints[A],2011
[186]Liu, Xiaoying, Huang, Mingliang, Wu, C. M. L., Wang, Lai, L (reprint author), Dalian Univ Technol, Dept Mat Engn, Liaoning, Peoples R China..Effect of Y2O3 particles on microstructure formation and shear properties of Sn-58Bi solder[J],JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2010,21(10):1046-1054
[187]Chen, L. D., Zhou, S. M., Huang, M. L., ML (reprint author), Dalian Univ Technol, Elect Packaging Mat Lab, Sch Mat Sci & Engn, 2 Linggong Rd, Dalian 116024, Peoples R China..Effect of electromigration on intermetallic compound formation in line-type Cu/Sn/Cu interconne...[J],JOURNAL OF ALLOYS AND COMPOUNDS,2010,504(2):535-541
[188]黄明亮, 柏冬梅, Huang, M.-L.(huang@dlut.edu.cn).钎焊及时效过程中化学镀Ni-P与Sn-3.5Ag的界面反应[J],中国有色金属学报,2010,20(6):1189-1194
[189]Liu, Xiaoying, Huang, Mingliang, Zhao, Yanhui, Wu, C. M. L., Wang, Lai, L (reprint author), Dalian Univ Technol, Dept Mat Engn, Dalian 116024, Liaoning, Peoples R China..The adsorption of Ag3Sn nano-particles on Cu-Sn intermetallic compounds of Sn-3Ag-0.5Cu/Cu duri...[J],JOURNAL OF ALLOYS AND COMPOUNDS,2010,492(1-2):433-438
[190]Liu, Huan, Huang, Mingliang, Ma, Haitao, Cui, Yipeng.Comparative Study of Interfacial Reactions of High-Sn Pb-free Solders on (001) Ni Single Crysta...[A],2010,293-298

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