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Professor Supervisor of Doctorate Candidates Supervisor of Master's Candidates

Paper Publications

[171]刘晓英, 王来, 黄明亮, 赵艳辉, 罗忠兵, 马海涛.刘晓英；马海涛；罗忠兵；赵艳辉；黄明亮；王来 Fe粉对Sn-3Ag-0.5Cu复合钎料组织及性能的影响[J],中国有色金属学报,,2012,22(4):1169-1172
[172]Huang, M. L., Ye, S., Zhao, N., ML (reprint author), Dalian Univ Technol, Elect Packaging Mat Lab, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Current-induced interfacial reactions in Ni/Sn-3Ag-0.5Cu/Au/Pd(P)/Ni-P flip chip interconnect[J],JOURNAL OF MATERIALS RESEARCH,2011,26(24):3009-3019
[173]Huang M., Chen L., Zhou S., Ye S..Effect of surface finish (OSP and ENEPIG) on failure mechanism induced by electromigration in Sn-...[A],2011,297-301
[174]Yang F., Liu L.W., Huang M.L..Comparative study on interfacial reactions between Sn-3.5Ag, Sn-3.0Ag-0.5Cu solder balls and ENEP...[A],2011,280-286
[175]段玉平, 黄明亮, 陈国清.高校班主任的现状调查及制度建设[J],教育教学论坛,2011,23:235-237
[176]Zhou, Shaoming, Huang, Mingliang, Chen, Leida, Ye, Song, Yuming, Wang, Jifan, Cao, Xi.Electromigration-Induced Failure of Ni/Sn3.0Ag0.5Cu/ENEPIG Flip Chip Solder Joint[A],2011,321-326
[177]Gao, Yanfang, Cheng, Congqian, Huang, Mingliang, Wang, Lihua, Zhao, Jie.Corrosion of Sn-0.75Cu Solder and Sn-0.75Cu/Cu Joint in Salt Solutions[A],2011,917-920
[178]Kang, Ning, Huang, Mingliang, Zhou, Qiang, Ma, Haitao.Mechanical Properties and Electrochemical Corrosion Behavior of Al-Cu Solder Joint with Sn-Zn B...[A],2011,333-337
[179]Liu, Luwei, Huang, Mingliang, Yang, Fan, Ting.Effect of Solder Volume on Interfacial Reaction between Sn-3Ag-0.5Cu Solder Ball and Cu Pad aft...[A],2011,327-332
[180]Chen, Leida, Huang, Mingliang, Zhou, Shaoming, Ye, Song, Yuming, Wang, Jifan, Cao, Xi.Effect of Electromigration on Interfacial Reaction of Cu/Sn3.0Ag0.5Cu/Ni Solder Joint at High T...[A],2011,316-320

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