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Professor Supervisor of Doctorate Candidates Supervisor of Master's Candidates

Paper Publications

[161]Ma, H. T., Wang, J., Qu, L., An, L. L., Gu, L. Y., Huang, M. L..The study on the rapidly-solidified Sn-0.7Cu lead-free solders and the interface reactions with...[A],2012,360-364
[162]Zhou, Qiang, Huang, Mingliang, Zhao, Ning, Zhang, Zhijie.Effects of Cooling Rate and Solder Volume on the Formation of Large Ag3Sn Plates in Sn-Ag Based...[A],2012,1403-1406
[163]Wang, Xiaohui, Huang, Mingliang, Yang, Fan, Zhao, Ning.Simulation of IMC Layer Growth and Cu Consumption in Sn-Ag-xCu/Cu Solder Joints during Reflow[A],2012,822-826
[164]Ma, H. T., Qu, L., Wang, J., Gu, L. Y., Huang, M. L., An, L. L..Interfacial Reaction between Sn-9Zn/Sn Double Layers Solder and Cu[A],2012,392-396
[165]Ma, H. T., Qu, L., An, L. L., Huang, M. L., Zhao, H. J., Wang, J., Gu, L. Y..In-situ study on the formation and evolution behavior of voids at the interface during solderin...[A],2012,379-383
[166]Zhou Q., Huang M., Zhao N., Zhang Z..Effects of cooling rate and solder volume on the formation of large Ag 3Sn plates in Sn-Ag based ...[A],2012,1403-1406
[167]黄明亮, 段玉平, 雷明凯, 陈国清.机械大类工程教育专业认证探析[J],大连理工大学学报（社科版）,2012,12(S1):92-94
[168]Huang Ming-Liang, Chen Lei-Da, Zhou Shao-Ming, Zhao Ning, Huang, ML (reprint author), Dalian Univ Technol, Key Lab Liaoning Adv Welding & Joining Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Effect of electromigration on interfacial reaction in Ni/Sn3.0Ag0.5Cu/Au/Pd/Ni-P flip chip sold...[J],ACTA PHYSICA SINICA,2012,61(19)
[169]Ma H.T., Wang J., Qu L., An L.L., Gu L.Y., Huang M.L..The study on the rapidly-solidified Sn-0.7Cu lead-free solders and the interface reactions with C...[A],2012,361-365
[170]Ma H.T., Qu L., Zhao H.J., Wang J., Gu L.Y., An L.L., Huang M.L..In-situ study on the formation and evolution behavior of voids at the interface during soldering ...[A],2012,380-384

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