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Professor Supervisor of Doctorate Candidates Supervisor of Master's Candidates

Paper Publications

[151]Ma H.T., An L.L., Qu L., Wang J., Gu L.Y., Huang M.L..Interfacial reaction between Sn-9Zn/Sn double layers solder and Cu[A],2012,393-397
[152]Liu, Xiaoying, Huang, Mingliang, Zhao, Ning.Effect of Cu6Sn5 particles on microstructure formation and mechanical properties of Sn-58Bi sol...[A],2012,422-424
[153]Liu, Ting, Huang, Mingliang, Zhao, Ning.Interfacial Reactions between Cu Single Crystals and Lead-free Solders during Solid-State Aging[A],2012,493-497
[154]Yang, Fan, Huang, Mingliang, Zhao, Ning.Study on Short Time Interfacial Reactions between Sn-3.0Ag-0.5Cu Solder Balls and ENEPIG Pads[A],2012,498-501
[155]潘剑灵, 赵宁, 黄明亮, Huang, M.-L.(huang@dlut.edu.cn).分步法电镀制备的Au-Sn共晶凸点的微观组织[J],中国有色金属学报,2012,22(7):2016-2022
[156]Huang, M. L., Pan, J. L., Ma, H. T., Zhao, N., ML (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Elect Packaging Mat Lab, Dalian 116024, Peoples R China..Interfacial reactions of sequentially electroplated Au/Sn/Au films on Si chips[J],MATERIALS SCIENCE AND TECHNOLOGY,2012,28(7):837-843
[157]刘晓英, 马海涛, 罗忠兵, 赵艳辉, 黄明亮, 王来, Wang, L.(wangl@dlut.edu.cn).Fe粉对Sn-3Ag-0.5Cu复合钎料组织及性能的影响[J],中国有色金属学报,2012,22(4):1169-1176
[158]Huang, M. L., Zhou, S. M., Chen, L. D., ML (reprint author), Dalian Univ Technol, Sch Mat Sci Engn, Elect Packaging Mat Lab, Dalian 116024, Peoples R China..Electromigration-Induced Interfacial Reactions in Cu/Sn/Electroless Ni-P Solder Interconnects[J],JOURNAL OF ELECTRONIC MATERIALS,2012,41(4):730-740
[159]Yang, Fan, Zhou, Qiang, Liu, Ting, Huang, Mingliang, Luwei.Effect of Solder Volume on Interfacial Reaction between Sn-3.0Ag-0.5Cu Solder Balls and the Sub...[A],2012,44(1):885-890
[160]黄明亮, 陈雷达, 周少明, Huang, ML (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..电迁移对Ni/Sn3.0Ag0.5Cu/Cu焊点界面反应的影响[J],金属学报,2012,48(03):321-328

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