DALIAN UNIVERSITY OF TECHNOLOGY
Login
中文
Home
Scientific Research
Research Projects
Published Books
Patents
Paper Publications
Research Field
Teaching Research
Teaching Achievement
Teaching Information
Teaching Resources
Awards and Honours
Other Rewards
Academic Honor
Scientific Awards
Enrollment Information
Student Information
My Album
Blog
Current position:
Home
>>
Scientific Research
>>
Paper Publications
Mingliang Huang
Personal Information
Professor Supervisor of Doctorate Candidates Supervisor of Master's Candidates
Paper Publications
[141]赵宁, 黄明亮, 马海涛, 潘学民, 刘晓英, Zhao, N (reprint author), Dalian Univ Technol, Key Lab Liaoning Adv Welding & Joining Technol, Dalian 116024, Peoples R China..液态Sn-Cu钎料的黏滞性与润湿行为研究[J],物理学报,2013,62(08):406-412
[142]黄明亮, 周少明, 陈雷达, 张志杰, Huang, ML (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Ni-P消耗对焊点电迁移失效机理的影响[J],金属学报,2013,49(01):81-86
[143]赵宁, 黄明亮, 马海涛, 潘学民, 刘晓英.液态Sn-Cu钎料的粘滞性与润湿行为研究[J],物理学报,2013,62(8):86601-86601
[144]Chen, Leida, Feng, Yi, Liu, Xiaoyan, Huang, Mingliang.Effects of Temperature and Current Density on (Au, Pd, Ni)Sn-4 Redistribution and Ni-P Consumpt...[A],2013,1064-+
[145]Ma, H. T., Qu, L., Huang, M. L., Gu, L. Y., Zhao, N., Wang, L (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..In-situ study on growth behavior of Ag3Sn in Sn-3.5Ag/Cu soldering reaction by synchrotron radi...[J],JOURNAL OF ALLOYS AND COMPOUNDS,2012,537:286-290
[146]陈雷达, 周少明, 黄明亮, Chen, LD (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..电迁移对Ni/Sn/Ni-P焊点界面反应的影响[J],稀有金属材料与工程,2012,41(10):1785-1789
[147]程从前, 黄明亮, 赵杰, 薛冬峰, Zhao, J (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116085, Peoples R China..均恒磁场对Cu与液态SnZn合金间化合物层结晶行为的影响[J],中国有色金属学报(英文版),2012,22(9):2312-2319
[148]Huang, M. L., Zhou, Q., Y. Z., Kang, N., ML (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Key Lab Liaoning Adv Welding & Joining Technol, Dalian 116024, Peoples R China..Effect of Ni Content on Mechanical Properties and Corrosion Behavior of Al/Sn-9Zn-xNi/Cu Joints[J],JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY,2012,28(9):844-852
[149]黄明亮, 陈雷达, 周少明, 赵宁.电迁移对Ni/Sn3.0Ag0.5Cu/Au/Pd/Ni—P倒装焊点界面反应的影响[J],物理学报,2012,61(19):503-511
[150]Pan, Song, Huang, Mingliang, Zhao, Ning, Zhou, Shaoming, Zhang, Zhijie.Dissolution of Substrates in Line-type Cu/Sn/Cu and Cu/Sn/Ni Interconnects under Current Stress...[A],2012,1399-1402
total238 15/24
first
previous
next
last
Page