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Mingliang Huang

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Professor Supervisor of Doctorate Candidates Supervisor of Master's Candidates

Paper Publications

[191]张福顺, 黄明亮, 潘剑灵, 王来.无氰金-锡合金电镀液的成分优化及电流密度确定[J],机械工程材料,2010,34(11):50-54
[192]黄明亮, 刘晓英.Electromigration of 300 μm diameter Sn-3.0Ag-0.5Cu lead-free bumps in flip chip package[A],2010,1132-1137
[193]Pan, Jianling, Huang, Mingliang.Au-Sn Co-electroplating solution for Flip Chip-LED Bumps[A],2010,283-287
[194]Liu, Luwei, Huang, Mingliang.Effect of Solder Volume on Interfacial Reactions between Sn3.5Ag0.75Cu Solder Balls and Cu Pad[A],2010,299-304
[195]Ye, Song, Huang, Mingliang, Chen, Leida, Liu, Xiaoying.Electromigration of 300 mu m Diameter Sn-3.0Ag-0.5Cu Lead-Free Bumps in Flip Chip Package[A],2010,1132-1137
[196]Ye S., Huang M., Chen L., Liu X..Electromigration of 300 m diameter Sn-3.0Ag-0.5Cu lead-free bumps in flip chip package[A],2010,1132-1137
[197]Zhou, Shaoming, Huang, Mingliang, Chen, Leida.Electromigration-induced Interfacial Reactions in Line-type Cu/Sn/ENIG Interconnect[A],2010,467-471
[198]黄明亮, 柏冬梅.化学镀Ni-P与Sn-3.5Ag在钎焊及时效过程中的界面反应[J],中国有色金属学报,2010,20(6):1189-1194
[199]黄明亮.Interfacial Reactions and Reliability Issues of Fine Pitch Flip-Chip Lead-free Solder Joints[A],2010
[200]Fan, Nanzi, Huang, Mingliang, Wang, Lai.Electroless Nickel-Boron Plating on Magnesium Alloy[A],2010,288-292

total238 20/24

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