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Professor Supervisor of Doctorate Candidates Supervisor of Master's Candidates

Paper Publications

[201]Huang, Yingzhuo, Mingliang, Kang, Ning.Mechanical Property and Electrochemical Corrosion Behavior of Al/Sn-9Zn-XNi/Cu Joints[A],2010,422-428
[202]柏冬梅, 黄明亮.镀液pH值及浓度对铝基表面化学镀镍-磷镀层磷含量及镀速的影响[J],机械工程材料,2010,34(6):28-32
[203]黄明亮.Effect of electromigration on intermetallic compound formation in Cu/Sn/Cu and Cu/Sn/Ni interconn...[A],2010,176-181
[204]闫佳, 黄明亮.预处理对AZ31镁合金表面Ni-B化学镀层形貌及性能的影响[J],材料保护,2009,42(12):28-31,37
[205]Liu, Yang, Huang, Mingliang.Sequential Non-cyanide Electroplating Au/Sn/Au Films for Flip Chip-LED Bumps[A],2009,802-805
[206]Liu, Xiaoying, Zhao, Yanhui, Huang, Mingliang, Wu, C. M. L., Wang, Lai.Liquid-state Interfacial Reactions between Sn-Ag-Cu-Fe Composite Solders and Cu Substrate[A],2009,611-+
[207]Chen L.D., Huang M..Effect of electromigration on intermetallic compound formation in Cu/Sn/Cu interconnect[A],2009,666-669
[208]Qing, Xiangyong, Huang, Mingliang, Pan, Jianlin.Effect of [Au]/[Na(2)SO(3)] Molar Ratio on Co-electroplating Au-Sn Alloys in Sulfite-based Solu...[A],2009,798-801
[209]Cui, Yipeng, Huang, Mingliang.Comparative Study of Interfacial Reactions of High-Sn Lead-free Solders on Single Crystal Cu an...[A],2009,517-520
[210]Cheng, Cong-qian, Zhao, Jie, Xu, Yang, Fu-Min, Huang, Ming-liang, J (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian, Peoples R China..The growth behaviours of IMC layers in solid-liquid interfacial reactions of Sn1.5Cu/Cu in high...[J],SOLDERING & SURFACE MOUNT TECHNOLOGY,2009,21(2):14-18

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