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Professor Supervisor of Doctorate Candidates Supervisor of Master's Candidates

Paper Publications

[211]黄明亮.Effect of [Au]/[Na2SO3] Molar Ratio on Co-electroplating Au-Sn Alloys in Sulfite-based Solution[A],2009,878-881
[212]Chen, L. D., Huang, Mingliang.Effect of Electromigration on Intermetallic Compound Formation in Cu/Sn/Cu Interconnect[A],2009,590-593
[213]米青霞, 黄明亮, 王来, Mi, Q.-X..电流密度对无氰电镀Au凸点生长行为的影响[J],中国有色金属学报,2008,18(10):1852-1857
[214]冯炜, 赵杰, 邢丽, 马海涛, 黄明亮, 王来.基于Z-参数的高温材料持久强度的可靠性分析[A],2007,1
[215]冯炜, 赵杰, 邢丽, 马海涛, 黄明亮, 王来.基于Z参数的高温材料持久强度的可靠性分析[A],2007,Vol.32:469-472
[216]冯炜, 赵杰, 王来, 邢丽, 马海涛, 黄明亮.基于Z参数的高温材料持久强度的可靠性分析[J],金属热处理,2007,32(z1):469-472
[217]Huang, M..Shear failure analysis of sub-50 μm flip chip lead-free solder bumps[A],2007
[218]Cheng, Cong-Qian, Zhao, Jie, Xu, Yang, Fu-Min, Huang, Ming-Liang.The growth Behaviors of IMC layers in solid-liquid interfacial reactions of Sn1.5Cu/Cu in high ...[A],2007,127-+
[219]Huang, Mingliang.Shear failure analysis of sub-50 mu m flip chip lead-free solder bumps[A],2007,145-148
[220]Huang, ML, Loeher, T, Manessis, D, Boettcher, L, Ostmann, A, Reichl, H, ML (reprint author), Dalian Univ Technol, Dept Mat Sci & Engn, Dalian 116024, Peoples R China..Morphology and growth kinetics of intermetallic compounds in solid-state interfacial reaction o...[J],JOURNAL OF ELECTRONIC MATERIALS,2006,35(1):181-188

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