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Paper Publications

[221]Huang, ML, Wu, CML, Wang, L, ML (reprint author), Dalian Univ Technol, Dept Mat Sci & Engn, Dalian 116024, Peoples R China..Creep resistance of tin-based lead-free solder alloys[J],JOURNAL OF ELECTRONIC MATERIALS,2005,34(11):1373-1377
[222]Huang, ML, Wang, L, ML (reprint author), Dalian Univ Technol, Dept Mat Sci & Engn, Dalian 116024, Peoples R China..Effects of Cu, Bi, and In on microstructure and tensile properties of Sn-Ag-X(Cu, Bi, In) solde...[J],METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE,2005,36A(6):1439-1446
[223]Huang, ML, Loeher, T, Ostmann, A, Reichl, H, ML (reprint author), Dalian Univ Technol, Dept Mat Sci & Engn, Dalian 116024, Peoples R China..Role of Cu in dissolution kinetics of Cu metallization in molten Sn-based solders[J],APPLIED PHYSICS LETTERS,2005,86(18):1-3
[224]黄明亮, 王来, 王富岗, Wang, L..机械合金化无铅钎料Sn-5Sb研究[J],大连理工大学学报,2003,43(4):447-451
[225]Huang, ML, Wu, CML, Wang, L, CML (reprint author), City Univ Hong Kong, Dept Phys & Mat Sci, 83 Tat Chee Ave, Hong Kong, Peoples R China..Creep behavior of eutectic Sn-Ag lead-free solder alloy[J],JOURNAL OF MATERIALS RESEARCH,2002,17(11):2897-2903
[226]Wang, L, Yu, DQ, Zhao, J, Huang, ML, J (reprint author), Dalian Univ Technol, Dept Mat Engn, Dalian 116023, Liaoning Prov, Peoples R China..Improvement of wettability and tensile property in Sn-Ag-RE lead-free solder alloy[J],MATERIALS LETTERS,2002,56(6):1039-1042
[227]Wu, CML, Huang, ML, CML (reprint author), City Univ Hong Kong, Dept Phys & Mat Sci, Hong Kong, Peoples R China..Creep Behavior of eutectic Sn-Cu lead-free solder alloy (vol 31, pg 442, 2002)[J],JOURNAL OF ELECTRONIC MATERIALS,2002,31(7):828-828
[228]黄明亮, 于大全, 王来, 王富岗.Sn-6Bi-2Ag(Cu, Sb)无铅钎料合金微观组织分析[J],中国有色金属学报,2002,12(3):486-490
[229]Wu, CML, Huang, ML, CML (reprint author), City Univ Hong Kong, Dept Phys & Mat Sci, Hong Kong, Peoples R China..Creep behavior of eutectic Sn-Cu lead-free solder alloy[J],43rd Electronic Materials Conference,2002,31(5):442-448
[230]黄明亮, 王来, 王富岗, Huang, M.-L..机械合金化无铅钎料Sn-9Zn研究[J],大连理工大学学报,2001,41(6):686-690

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