Personal Information
Professor Supervisor of Doctorate Candidates Supervisor of Master's Candidates
Paper Publications
- [1] Huang, ML.Huang, ML (reprint author), Dalian Univ Technol, Dept Mat Sci & Engn, Dalian 116024, Peoples R China..Wu, CML,Wang, L.Creep resistance of tin-based lead-free solder alloys[J],JOURNAL OF ELECTRONIC MATERIALS,2005,34(11):1373-1377
- [2] Huang, ML.Huang, ML (reprint author), Dalian Univ Technol, Dept Mat Sci & Engn, Dalian 116024, Peoples R China..Wang, L.Effects of Cu, Bi, and In on microstructure and tensile properties of Sn-Ag-X(Cu, Bi, In) solders[J],METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE,2005,36A(6):1439-1446
- [3] Huang, ML.Huang, ML (reprint author), Dalian Univ Technol, Dept Mat Sci & Engn, Dalian 116024, Peoples R China..Reichl, H,Loeher, T,Ostmann, A.Role of Cu in dissolution kinetics of Cu metallization in molten Sn-based solders[J],APPLIED PHYSICS LETTERS,2005,86(18):1-3
- [4] 黄明亮.Wang, L..王来,王富岗.机械合金化无铅钎料Sn-5Sb研究[J],大连理工大学学报,2003,43(4):447-451
- [5] Huang, ML.Wu, CML (reprint author), City Univ Hong Kong, Dept Phys & Mat Sci, 83 Tat Chee Ave, Hong Kong, Hong Kong, Peoples R China..Wang, L,Wu, CML.Creep behavior of eutectic Sn-Ag lead-free solder alloy[J],JOURNAL OF MATERIALS RESEARCH,2002,17(11):2897-2903
- [6] Wang, L.Zhao, J (reprint author), Dalian Univ Technol, Dept Mat Engn, Dalian 116023, Liaoning Prov, Peoples R China..Huang, ML,Yu, DQ,Zhao, J.Improvement of wettability and tensile property in Sn-Ag-RE lead-free solder alloy[J],MATERIALS LETTERS,2002,56(6):1039-1042
- [7] Wu, CML.Wu, CML (reprint author), City Univ Hong Kong, Dept Phys & Mat Sci, Hong Kong, Hong Kong, Peoples R China..Huang, ML.Creep Behavior of eutectic Sn-Cu lead-free solder alloy (vol 31, pg 442, 2002)[J],JOURNAL OF ELECTRONIC MATERIALS,2002,31(7):828-828
- [8] 黄明亮.王富岗,于大全,王来.Sn-6Bi-2Ag(Cu, Sb)无铅钎料合金微观组织分析[J],中国有色金属学报,2002,12(3):486-490
- [9] Wu, CML.Wu, CML (reprint author), City Univ Hong Kong, Dept Phys & Mat Sci, Hong Kong, Hong Kong, Peoples R China..Huang, ML.Creep behavior of eutectic Sn-Cu lead-free solder alloy[J],43rd Electronic Materials Conference,2002,31(5):442-448
- [10] 黄明亮.Huang, M.-L..王富岗,王来.机械合金化无铅钎料Sn-9Zn研究[J],大连理工大学学报,2001,41(6):686-690