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个人信息Personal Information
教授
博士生导师
硕士生导师
主要任职：材料科学与工程学院副院长
性别：男
毕业院校：大连理工大学
学位：博士
所在单位：材料科学与工程学院
学科：材料学
办公地点：知远楼B515(新材料大楼)
电子邮箱：zhaoning@dlut.edu.cn
扫描关注
- [161]Wang, Xiaohui, Huang, Mingliang, Yang, Fan, Zhao, Ning.Simulation of IMC Layer Growth and Cu Consumption in Sn-Ag-xCu/Cu Solder Joints during Reflow[A],2012,822-826
- [162]Zhou, Qiang, Huang, Mingliang, Zhao, Ning, Zhang, Zhijie.Effects of Cooling Rate and Solder Volume on the Formation of Large Ag3Sn Plates in Sn-Ag Based...[A],2012,1403-1406
- [163]Huang, M. L., Ye, S., Zhao, N., ML (reprint author), Dalian Univ Technol, Elect Packaging Mat Lab, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Current-induced interfacial reactions in Ni/Sn-3Ag-0.5Cu/Au/Pd(P)/Ni-P flip chip interconnect[J],JOURNAL OF MATERIALS RESEARCH,2011,26(24):3009-3019
- [164]Pan, Xuemin, Zhao, Ning, Ding, Ruifang, Wei, Guanglin, Wang, Lai.The Correlation between the Liquid Structure and the Solidification Microstructure of Sn-Cu Lea...[A],2010,654-656:1385-+
- [165]Pan, Xuemin, Zhao, Ning, Ding, Ruifang, Wei, Guanglin, Wang, Lai.The correlation between the liquid structure and the viscosity of Sn-Cu lead-free solders[A],2009,97-101:679-+
- [166]Zhao, Ning, Wang, Lai, Wan, Lixi, Cao, Liqiang.Absorption of Ag3Sn on Cu6Sn5 Intermetallic Compounds at Sn-3.5Ag-xCu/Cu Interfaces[A],2009,829-+
- [167]Zhao, N., Pan, X. M., Yu, D. Q., Ma, H. T., Wang, L., N (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Viscosity and Surface Tension of Liquid Sn-Cu Lead-Free Solders[J],50th Electronic Materials Conference,2009,38(6):828-833
- [168]Zhao, Ning, Ma, Haitao, Xie, Haiping, Wang, Lai, L (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Wetting Behavior and Interfacial Reactions in (Sn-9Zn)-2Cu/Ni Joints during Soldering and Isoth...[J],JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY,2009,25(3):410-414
- [169]Zhao Ning, Ma Haitao, Wang Lai, Zhao, N (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, State Key Lab Mat Modificat, Dalian 116024, Peoples R China..Microstructure, Mechanical Property and Interfacial Reaction of Sn-Cu Based Multicomponent Lead...[J],RARE METAL MATERIALS AND ENGINEERING,2009,38:107-111
- [170]Zhao, Ning, Ma, Hai-tao, Wang, Lai, L (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian, Peoples R China..Interfacial reactions between Sn-Cu based multicomponent solders and Ni substrates during solde...[J],SOLDERING & SURFACE MOUNT TECHNOLOGY,2009,21(2):19-23
- [171]赵宁, 潘学民, 马海涛, 王来, Wang, L (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Sn-Cu钎料液态结构的研究[J],金属学报,2008,44(4):467-472
- [172]Zhao, Ning, Pan, Xuemin, Ma, Haitao, Dong, Chuang, Guo, Shuhong, Lu, Wen, Wang, Lai.The liquid structure of Sn-based lead-free solders and the correlative effect in liquid-solid i...[A],2008,98
- [173]Zhao, Ning, Wang, Jianhui, Ma, Haitao, Lai.Interfacial reactions in Sn-xZn-Cu/Cu couples during soldering[A],2008,373-374:543-+
- [174]Zhao, Ning, Ma, Hai-tao, Wang, Lai.Interfacial reactions between Sn-Cu based multicomponent solders and ni substrates during solde...[A],2007,222-+