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个人信息Personal Information
教授
博士生导师
硕士生导师
主要任职：材料科学与工程学院副院长
性别：男
毕业院校：大连理工大学
学位：博士
所在单位：材料科学与工程学院
学科：材料学
办公地点：知远楼B515(新材料大楼)
电子邮箱：zhaoning@dlut.edu.cn
扫描关注
- [141]Li, Hua, Zhao, Huijing, Ning, Ma, Haitao, Qu, Lin.Mechanism of Cu6Sn5 layer act as a diffusion barrier layer[A],2013,1086-1089
- [142]Huang, Mingliang, Liu, Shuang, Zhao, Ning, Long, Haohui, Li, Jianhui, Hong, Weiqiang.Drop Failure Modes of A Wafer-Level Chip-Scale Packaging[A],2013,1094-+
- [143]Ma, Hai-Tao, Wang, Jie, Qu, Lin, Zhao, Ning, Kunwar, A., HT (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..A Study on the Physical Properties and Interfacial Reactions with Cu Substrate of Rapidly Solid...[J],JOURNAL OF ELECTRONIC MATERIALS,2013,42(8):2686-2695
- [144]Huang, M. L., Zhou, Q., Zhao, N., Chen, L. D., ML (reprint author), Dalian Univ Technol, Elect Packaging Mat Lab, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Interfacial microstructure and mechanical properties of In-Bi-Sn lead-free solder[J],JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2013,24(7):2624-2629
- [145]Huang, M. L., Zhang, Z. J., Zhao, N., Zhou, Q., ML (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Elect Packaging Mat Lab, Dalian 116024, Peoples R China..A synchrotron radiation real-time in situ imaging study on the reverse polarity effect in Cu/Sn...[J],SCRIPTA MATERIALIA,2013,68(11):853-856
- [146]Liu, Xiaoying, Huang, Mingliang, Zhao, Ning.Interfacial reactions between Sn-Ag-Cu-Fe composite solder and Cu substrate[A],2013,706-708:138-141
- [147]黄明亮, 陈雷达, 赵宁, Huang, M.-L.(huang@dlut.edu.cn).Cu-Ni交互作用对Cu/Sn/Ni焊点液-固界面反应的影响[J],中国有色金属学报,2013,24(3):1073-1078
- [148]Huang, Mingliang, Yang, Fan, Zhao, Ning, Liu, Xiaoying.Solder Volume Effect on Interfacial Reaction between Sn-3.0Ag-0.5Cu Solder Balls and Cu Substra...[A],2013,52(1):753-758
- [149]赵宁, 刘晓英, 黄明亮, 马海涛, 潘学民.液态Sn-Cu钎料的粘滞性与润湿行为研究[J],物理学报,2013,62(8):86601-86601
- [150]Ma, H. T., Wang, L., Gu, L. Y., Zhao, N., Qu, Huang, M. L., L (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..In-situ study on growth behavior of Ag3Sn in Sn-3.5Ag/Cu soldering reaction by synchrotron radi...[J],JOURNAL OF ALLOYS AND COMPOUNDS,2012,537:286-290
- [151]黄明亮, 陈雷达, 周少明, 赵宁.电迁移对Ni／Sn3．0Ag0．5Cu／Au／Pd／Ni—P倒装焊点界面反应的影响[J],物理学报,2012,61(19):503-511
- [152]Yang, Fan, Huang, Mingliang, Zhao, Ning.Study on Short Time Interfacial Reactions between Sn-3.0Ag-0.5Cu Solder Balls and ENEPIG Pads[A],2012,498-501
- [153]Liu, Xiaoying, Huang, Mingliang, Zhao, Ning.Effect of Cu6Sn5 particles on microstructure formation and mechanical properties of Sn-58Bi sol...[A],2012,422-424
- [154]Liu, Ting, Zhao, Ning, Huang, Mingliang.Interfacial Reactions between Cu Single Crystals and Lead-free Solders during Solid-State Aging[A],2012,493-497
- [155]Pan, Song, Zhang, Zhijie, Zhou, Shaoming, Zhao, Ning, Huang, Mingliang.Dissolution of Substrates in Line-type Cu/Sn/Cu and Cu/Sn/Ni Interconnects under Current Stress...[A],2012,1399-1402
- [156]刘梁, 潘学民, 赵宁.温度对Sn-0.7Cu无铅钎料表面张力的影响[J],物理测试,2012,30(4):32-35
- [157]潘剑灵, 黄明亮, 赵宁, Huang, M.-L.(huang@dlut.edu.cn).分步法电镀制备的Au-Sn共晶凸点的微观组织[J],中国有色金属学报,2012,22(7):2016-2022
- [158]Huang, M. L., Pan, J. L., Ma, H. T., Zhao, N., ML (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Elect Packaging Mat Lab, Dalian 116024, Peoples R China..Interfacial reactions of sequentially electroplated Au/Sn/Au films on Si chips[J],MATERIALS SCIENCE AND TECHNOLOGY,2012,28(7):837-843
- [159]Zhou Q., Huang M., Zhao N., Zhang Z..Effects of cooling rate and solder volume on the formation of large Ag 3Sn plates in Sn-Ag based ...[A],2012,1403-1406
- [160]Huang Ming-Liang, Chen Lei-Da, Zhou Shao-Ming, Zhao Ning, Huang, ML (reprint author), Dalian Univ Technol, Key Lab Liaoning Adv Welding & Joining Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Effect of electromigration on interfacial reaction in Ni/Sn3.0Ag0.5Cu/Au/Pd/Ni-P flip chip sold...[J],ACTA PHYSICA SINICA,2012,61(19)