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个人信息Personal Information
教授
博士生导师
硕士生导师
主要任职：材料科学与工程学院副院长
性别：男
毕业院校：大连理工大学
学位：博士
所在单位：材料科学与工程学院
学科：材料学
办公地点：知远楼B515(新材料大楼)
电子邮箱：zhaoning@dlut.edu.cn
扫描关注
- [121]Huang, Mingliang, Yang, Fan, Zhao, Ning, Liu, Xiaohua, Wang, Jingyun.Study on size effect and cross-interaction in Cu/Sn/Ni-P interconnects[A],2014,429-432
- [122]Huang, Mingliang, Zhang, Zhijie, Zhao, Ning, Feng, Xiaofei.Reverse Polarity Effect in Cu/Sn-9Zn/Ni Interconnect under High Current Density at High Tempera...[A],2014,433-436
- [123]Li, Shuang, Du, Yao, Qu, Lin, Kunwar, Anil, Sun, Junhao, Liu, Jiahui, Zhao, Ning, Ma, Haitao, Huang, Mingliang.The growth behavior of IMC on the Sn/Cu interface during solidification of multiple reflows[A],2014,937-939
- [124]Huang, M. L., Yang, F., Zhao, N., Y. C., ML (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Elect Packaging Mat Lab, Dalian 116024, Peoples R China..Synchrotron radiation real-time in situ study on dissolution and precipitation of Ag3Sn plates ...[J],JOURNAL OF ALLOYS AND COMPOUNDS,2014,602:281-284
- [125]Qu, L., Ma, H. T., Zhao, H. J., Kunwar, Anil, N., HT (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116085, Peoples R China..In situ study on growth behavior of interfacial bubbles and its effect on interfacial reaction ...[J],APPLIED SURFACE SCIENCE,2014,305:133-138
- [126]Qu, Lin, Zhao, Ning, Ma, Haitao, Huijing, Huang, Mingliang, HT (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116085, Peoples R China..In situ study on the effect of thermomigration on intermetallic compounds growth in liquid-soli...[J],JOURNAL OF APPLIED PHYSICS,2014,115(20)
- [127]Qu, L., Zhao, N., H. J., Ma, H. T., Huang, M. L., HT (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..In situ study of the real-time growth behavior of Cu6Sn5 at the Sn/Cu interface during the sold...[J],SCRIPTA MATERIALIA,2014,72-73:43-46
- [128]Huang, M. L., Zhou, Q., Zhao, N., Liu, X. Y., Zhang, Z. J., ML (reprint author), Dalian Univ Technol, Elect Packaging Mat Lab, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Reverse polarity effect and cross-solder interaction in Cu/Sn-9Zn/Ni interconnect during liquid...[J],JOURNAL OF MATERIALS SCIENCE,2014,49(4):1755-1763
- [129]潘学民, 丁瑞芳, 刘梁, 程浩, 赵宁, 曹志强, Pan, X.-M., School of Materials Science, Engineering, Dalian University of Technology, Dalian 116024, China, email: xmpan@dlut.edu.cn.S n-Cu钎料液态结构与黏度分子动力学研究[J],大连理工大学学报,2014,54(1):60-70
- [130]黄明亮, 赵宁.Synchrotron radiation real-time in situ study on dissolution and precipitation of Ag3Sn plates in...[J],Journal of Alloys and Compounds,2014,602(1):281-284
- [131]Liu, Xiaoying, Huang, Mingliang, Zhao, Ning, Wang, Lai, XY (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Liquid-state and solid-state interfacial reactions between Sn-Ag-Cu-Fe composite solders and Cu...[J],JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2014,25(1):328-337
- [132]Zhao, N., Liu, X. Y., Huang, M. L., Ma, H. T., N (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Elect Packaging Mat Lab, Dalian 116085, Peoples R China..Characters of multicomponent lead-free solders[J],JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2013,24(10):3925-3931
- [133]Huang, M. L., Zhou, Q., Zhao, N., Zhang, Z. J., ML (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Elect Packaging Mat Lab, Dalian 116024, Peoples R China..Abnormal Diffusion Behavior of Zn in Cu/Sn-9 wt.%Zn/Cu Interconnects During Liquid-Solid Electr...[J],JOURNAL OF ELECTRONIC MATERIALS,2013,42(10):2975-2982
- [134]Huang, Mingling, Zhang, Tongxin, Zhao, Ning, Jiao, Tingting.Interfacial Reactions of Co-electrodeposited Eutectic Au-Sn Solder Bumps on Ni and Cu Substrate...[A],2013,225-228
- [135]Zhao, Huijing, Ma, Haitao, Ning, Li, Hua, Qu, Lin.The study of cooling process' effect on the growth of IMC at Sn-3.5Ag/Cu soldering interface[A],2013,372-376
- [136]Huang, Mingliang, Zhang, Zhijie, Zhao, Ning, Feng, Xiaofei.Study on Liquid-Solid Electromigration in Cu/Sn-9Zn/Cu Interconnect Using Synchrotron Radiation...[A],2013,126-129
- [137]Qu, Lin, Ma, Haitao, Zhao, Huijing, Ning, Kunwar, Anil, Huang, Mingliang.The nucleation of Ag3Sn and the growth orientation relationships with Cu6Sn5[A],2013,377-381
- [138]Huang, Mingliang, Liu, Ting, Zhao, Ning, Hao, Hua.Interfacial Reaction in Cu/Sn/Cu Fine Pitch Interconnect during Soldering[A],2013,382-+
- [139]Liu, Xiaoying, Huang, Mingliang, Zhao, Ning, Wang, Lai.Effect of Fe addition to Sn-3Ag-0.5Cu solder on interfacial reactions during aging[A],2013,400-402
- [140]Huang, Mingliang, Yang, Fan, Zhao, Ning, Zhang, Fei.Dissolution and Precipitation of Ag3Sn Plates in Ultra Fine Solder Joints Using Synchrotron Rad...[A],2013,822-825