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个人信息Personal Information
教授
博士生导师
硕士生导师
主要任职：材料科学与工程学院副院长
性别：男
毕业院校：大连理工大学
学位：博士
所在单位：材料科学与工程学院
学科：材料学
办公地点：知远楼B515(新材料大楼)
电子邮箱：zhaoning@dlut.edu.cn
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- [101]赵宁, 钟毅, 黄明亮, 马海涛, Zhao, Ning.微焊点中金属原子的热迁移及其对界面反应影响的研究进展[J],中国有色金属学报,2015,25(8):2157-2166
- [102]Zhong, Yi, Huang, Mingliang, Ma, Haitao, Zhao, Ning.Synchrotron radiation in situ study on liquid-solid thermomigration in Cu/Sn/Ni solder joint[A],2015,1271-1274
- [103]Guo, Bingfeng, Kunwar, Anil, Ma, Haoran, Liu, Jiahui, Li, Shuang, Haiao, Sun, Junhao, Zhao, Ning.Effects of Soldering Temperature and Cooling Rate on the as-Soldered Microstructures of Interme...[A],2015,249-252
- [104]Liu, Jiaxi, Huang, Mingliang, Zhao, Ning, Zhang, Liwen.Microstructure and Mechanical Properties of Al/Sn-Zn-X/Cu Solder Joints[A],2015,1267-1270
- [105]Liu, Yawei, Huang, Mingliang, Feifei, Zhao, Ning.Effects of Stirring Speed on Composition and Morphology of Non-cyanide Co-electroplating Au-Sn ...[A],2015,1283-1286
- [106]Zhao, Jianfei, Zhang, Zhijie, Ning, Huang, Mingliang.Effect of Sn grain orientation on Cu diffusion in SnAgCu solder interconnect undergoing electro...[A],2015,1275-1278
- [107]Zhao, Ning, Zhong, Yi, Huang, Mingliang, Ma, Haitao.Interfacial reactions in Cu/Sn/Cu(Ni) systems during soldering under temperature gradient[A],2015,1263-1266
- [108]赵宁, 钟毅, 黄明亮, 马海涛, 刘小平, Zhao, N (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..热迁移对Cu/Sn/Cu焊点液-固界面Cu_6Sn_5生长动力学的影响[J],物理学报,2015,64(16):348-357
- [109]Huang, M. L., Zhang, F., Yang, Zhao, N., ML (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Elect Packaging Mat Lab, Dalian 116024, Peoples R China..Size effect on tensile properties of Cu/Sn-9Zn/Cu solder interconnects under aging and current ...[J],JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2015,26(4):2278-2285
- [110]陈希有, 伍红霞, 牟宪民, 赵宁, Chen, Xiyou(chenxy@dlut.edu.cn).电流型电场耦合无线电能传输技术[J],中国电机工程学报,2015,35(9):2279-2286
- [111]Huang, M. L., Yang, F., Zhao, N., Zhang, Z. J., ML (reprint author), Dalian Univ Technol, Elect Packaging Mat Lab, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..In situ study on dissolution and growth mechanism of interfacial Cu6Sn5 in wetting reaction[J],MATERIALS LETTERS,2015,139:42-45
- [112]Huang, M. L., Zhang, Z. J., Zhao, N., Yang, F., ML (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Elect Packaging Mat Lab, Dalian 116024, Peoples R China..In situ study on reverse polarity effect in Cu/Sn-9Zn/Ni interconnect undergoing liquid-solid e...[J],JOURNAL OF ALLOYS AND COMPOUNDS,2015,619:667-675
- [113]黄明亮, 张志杰, 冯晓飞, 赵宁, Huang, ML (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..液-固电迁移Ni/Sn-9Zn/Ni焊点反极性效应研究[J],金属学报,2015,51(01):93-99
- [114]黄明亮, 赵宁.Role of diffusion anisotropy in β-Sn in microstructural evolution of Sn-3.0Ag-0.5Cu flip chip bu...[J],Acta Materialia,2015,100(11):98-106
- [115]赵宁, 黄明亮, 马海涛.热迁移对Cu/Sn/Cu焊点液-固界面Cu6Sn5生长动力学的影响[J],物理学报,2015,64(16):166601-166601
- [116]Zhao, N., Huang, M. L., Zhong, Y., Ma, H. T., Pan, X. M., N (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Elect Packaging Mat Lab, Dalian 116085, Peoples R China..Effects of rare earth Ce addition on the microstructure, wettability and interfacial reactions ...[J],JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2015,26(1):345-352
- [117]Qu, Lin, Zhao, Ning, Ma, Haitao, Huijing, Huang, Mingliang, HT (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116085, Peoples R China..In Situ Study on Current Density Distribution and Its Effect on Interfacial Reaction in a Solde...[J],JOURNAL OF ELECTRONIC MATERIALS,2015,44(1):467-474
- [118]Zhao, N., Huang, M. L., Ma, H. T., Yang, F., Zhang, Z. J., N (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Elect Packaging Mat Lab, Dalian 116085, Peoples R China..Influence of Rare Earth Ce Addition on the Microstructure, Properties and Soldering Reaction of...[J],METALS AND MATERIALS INTERNATIONAL,2014,20(5):953-958
- [119]黄明亮, 赵宁.电子封装技术[J],国际学术动态,2014,04:39-41
- [120]Huang, Mingliang, Zhang, Fei, Yang, Fan, Zhao, Ning.Effect of electromigration on the tensile strength of Cu/Sn-9Zn/Cu solder interconnects[A],2014,1190-1193