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个人信息Personal Information
教授
博士生导师
硕士生导师
主要任职：材料科学与工程学院副院长
性别：男
毕业院校：大连理工大学
学位：博士
所在单位：材料科学与工程学院
学科：材料学
办公地点：知远楼B515(新材料大楼)
电子邮箱：zhaoning@dlut.edu.cn
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- [83]Zhao, N., Huang, M. L., Wu, C. M. L., N (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Elect Packaging Mat Lab, Dalian 116024, Peoples R China..Tensile creep behavior of Sn-Ag-Cu-Ni multicomponent lead-free solder alloy[J],JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2016,27(7):6630-6636
- [84]黄明亮, 赵宁, 刘爽, 何宜谦, Huang, ML (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..晶圆级芯片尺寸封装Sn-3.0Ag-0.5Cu 焊点跌落失效模式[J],中国有色金属学报（英文版）,2016,26(6):1663-1669
- [85]Kunwar, Anil, Ma, Haoran, Haitao, Sun, Junhao, Zhao, Ning, Huang, Mingliang, HT (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..On the increase of intermetallic compound's thickness at the cold side in liquid Sn and SnAg so...[J],MATERIALS LETTERS,2016,172:211-215
- [86]Huang, M. L., Zhao, N., Yang, F., Zhang, Z. J..Novel growth of whole preferred orientation intermetallic compound interconnects for 3D IC pack...[A],2016,2016-August:1216-1221
- [87]Zhong, Yi, Huang, Mingliang, Ma, Haitao, Dong, Wei, Wang, Yunpeng, Zhao, Ning, N (reprint author), Dalian Univ Technol, Elect Packaging Mat Lab, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..In situ study on Cu-Ni cross-interaction in Cu/Sn/Ni solder joints under temperature gradient[J],JOURNAL OF MATERIALS RESEARCH,2016,31(5):609-617
- [88]Zhong, Yi, Huang, Mingliang, Deng, Jianfeng, Ma, Haitao, Dong, Wei, Zhao, Ning.STUDY ON PRECIPITATION AND DISSOLUTION OF INTERFACIAL CU6SN5 DURING THERMOMIGRATION[A],2016
- [89]Huang, M. L., Yang, F., Zhao, N., ML (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Elect Packaging Mat Lab, Dalian 116024, Peoples R China..Thermomigration-induced asymmetrical precipitation of Ag3Sn plates in micro-scale Cu/Sn-3.5Ag/C...[J],MATERIALS & DESIGN,2016,89:116-120
- [90]黄明亮, 赵宁.Dominant effect of high anisotropy in beta-Sn grain on electromigration-induced failure mechanism...[J],Journal of Alloys and Compounds,2016,678(1):370-374
- [91]王云鹏, 宋学官, 赵宁, 马海涛.Effect of cooling condition and Ag on the growth of intermetallic compounds in Sn-based solder[J],APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING,2016,122(12):1052-1052
- [92]马海涛, 赵宁, 黄明亮.On the increase of intermetallic compounds thickness at the cold side in liquid Sn and SnAg solde...[J],Materials Letters,2016,172(1):211-215
- [93]赵宁, 黄明亮, 马海涛.Interfacial reactions of Ni/Sn-9Zn/Ni solder joint undergoing liquid-solid thermomigration[A],2016,1(1):273-276
- [94]马海涛, 王云鹏, 赵宁, 黄明亮.Formation mechanism and kinetic analysis of the morphology of Cu6Sn5 in the spherical solder join...[J],Journal of Material Science: Materials in Electronics,2016,28(1):5398-5406
- [95]黄明亮, 赵宁.Microstructure and interfacial reactions on Sn-Au-Ag solder joints on Cu and Ni substrates[A],2016,1(1):534-537
- [96]Huang, Mingliang, Zhang, Zhijie, Zhao, Ning, Yang, Fan, ML (reprint author), Dalian Univ Technol, Elect Packaging Mat Lab, Sch Mat Sci & Engn, Dalian 116024, Liaoning, Peoples R China..Migration behavior of indium atoms in Cu/Sn-52In/Cu interconnects during electromigration[J],JOURNAL OF MATERIALS RESEARCH,2015,30(21):3316-3323
- [97]Huang, M. L., Zhao, J. F., Zhang, Z. J., N., ML (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Elect Packaging Mat Lab, Dalian 116024, Peoples R China..Role of diffusion anisotropy in beta-Sn in microstructural evolution of Sn-3.0Ag-0.5Cu flip chi...[J],ACTA MATERIALIA,2015,100:98-106
- [98]Huang, M. L., Zhao, N., ML (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Elect Packaging Mat Lab, Dalian 116024, Peoples R China..Effect of Electromigration on the Type of Drop Failure of Sn-3.0Ag-0.5Cu Solder Joints in PBGA ...[J],JOURNAL OF ELECTRONIC MATERIALS,2015,44(10):3927-3933
- [99]陈希有, 牟宪民, 赵宁, 伍红霞.电容耦合式无线电能传输系统阻抗变换网络的设计[J],电工电能新技术,2015,34(9):57-63
- [100]Zhao, N., Zhong, Y., Huang, M. L., Ma, H. T., Dong, W., N (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Growth kinetics of Cu6Sn5 intermetallic compound at liquid-solid interfaces in Cu/Sn/Cu interco...[J],SCIENTIFIC REPORTS,2015,5:13491