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个人信息Personal Information
教授
博士生导师
硕士生导师
主要任职：材料科学与工程学院副院长
性别：男
毕业院校：大连理工大学
学位：博士
所在单位：材料科学与工程学院
学科：材料学
办公地点：知远楼B515(新材料大楼)
电子邮箱：zhaoning@dlut.edu.cn
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- [61]Yao, Mingjun, Yu, Daquan, Zhao, Ning, Fan, Jun, Xiao, Zhiyi, Ma, Haitao.DEVELOPMENT OF WAFER LEVEL HYBRID BONDING PROCESS USING PHOTOSENSITIVE ADHESIVE AND CU PILLAR B...[A],2017
- [62]Zhao, N., Wong, C. P., Ma, H. T., Huang, M. L., Dong, W., Zhong, Y., N (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China., Wong, CP (reprint author), Georgia Inst Technol, Atlanta, GA 30332 USA..Formation of highly preferred orientation of beta-Sn grains in solidified Cu/SnAgCu/Cu micro in...[J],APPLIED PHYSICS LETTERS,2017,110(9)
- [63]Zhong, Y., Zhao, N., Ma, H. T., Dong, W., Huang, M. L., N, Dong, W (reprint author), Dalian Univ Technol, Elect Packaging Mat Lab, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Retardation of thermomigration-induced Cu substrate consumption in Pb-free solder joints by Zn ...[J],JOURNAL OF ALLOYS AND COMPOUNDS,2017,695:1436-1443
- [64]Guo, Bingfeng, Jiang, Chengrong, Kunwar, Anil, Zhao, Ning, Chen, Jun, Wang, Yunpeng, Ma, Haitao.Effect of Ag concentration on the Cu6Sn5 growth in Sn-based solder/Cu joints at the isothermal ...[A],2017,1087-1091
- [65]Ma, H. R., Wang, Y. P., Chen, J., H. T., Zhao, N..The effect of reflow temperature on IMC growth in Sn/Cu and Sn0.7Cu/Cu solder bumps during mult...[A],2017,1402-1405
- [66]Zhong, Yi, Ma, Haitao, Dong, Wei, Zhao, Ning, Wong, Ching-Ping, Wang, Yunpeng.Formation of preferred orientation of Cu6Sn5 grains in Cu/Sn/Cu interconnects by soldering unde...[A],2017,1438-1441
- [67]Zhao, Ning, Wang, Mingyao, Zhong, Yi, Yunpeng, Wong, Ching-Ping, Ma, Haitao.Study on interfacial reactions in Cu/Sn-9Zn/Ni micro solder joints under temperature gradient[A],2017,1478-1482
- [68]赵宁, 董伟, 黄明亮, 马海涛.Formation of highly preferred orientation of β-Sn grains in solidified Cu/SnAgCu/Cu micro interc...[J],Applied Physics Letters,2017,110(9):93504-
- [69]Zhong, Y., Wong, C. P., Huang, M. L., Dong, W., Ma, H. T., Zhao, N..Low temperature Ni/Sn/Ni transient liquid phase bonding for high temperature packaging applicat...[A],2017,0:411-416
- [70]Guo, Bingfeng, Jiang, Chengrong, Kunwar, Anil, Chen, Jun, Zhao, Ning, Wang, Yunpeng, Ma, Haitao.In situ study the effects of Cu addition on the rapidly growth of Cu6Sn5 at the Sn-base solder/...[A],2017,974-979
- [71]Zhao, N., Zhong, Y., Huang, M. L., Ma, H. T., Dong, W., N (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Elect Packaging Mat Lab, Dalian 116024, Peoples R China..Dissolution and precipitation kinetics of Cu6Sn5 intermetallics in Cu/Sn/Cu micro interconnects...[J],INTERMETALLICS,2016,79:28-34
- [72]Ma, Haoran, Kunwar, Anil, Guo, Bingfeng, Sun, Junhao, Jiang, Chengrong, Wang, Yunpeng, Song, Xueguan, Zhao, Ning, Haitao, HT (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Effect of cooling condition and Ag on the growth of intermetallic compounds in Sn-based solder ...[J],APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING,2016,122(12)
- [73]Zhao, N., Zhong, Y., Huang, M. L., Dong, W., Ma, H. T., Wang, Y. P., N (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..In situ study on interfacial reactions of Cu/Sn-9Zn/Cu solder joints under temperature gradient[J],JOURNAL OF ALLOYS AND COMPOUNDS,2016,682:1-6
- [74]Huang, M. L., Zhao, J. F., Zhang, Z. J., N., ML (reprint author), Dalian Univ Technol, Elect Packaging Mat Lab, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Dominant effect of high anisotropy in beta-Sn grain on electromigration-induced failure mechani...[J],JOURNAL OF ALLOYS AND COMPOUNDS,2016,678:370-374
- [75]Fan, M., Huang, M. L., Zhao, N..Cross-solder interaction on interfacial reactions in Ni/Sn-3.0Ag-0.5Cu/Cu solder interconnects[A],2016,542-545
- [76]Kunwar, Anil, Sun, Junhao, Qu, Lin, Guo, Bingfeng, Zhao, Ning, Wang, Yunpeng, Ma, Haitao, Haoran, Qi, Meng.Positive Feedback on Imposed Thermal Gradient by Interfacial Bubbles in Cu/liquid Sn-3.5Ag/Cu J...[A],2016,608-611
- [77]Ma, Haoran, Kunwar, Anil, Meng, Zhixian, Guo, Bingfeng, Zhao, Ning, Haitao.The morphology variation of IMC on the solder/bubble interface under different cooling rates an...[A],2016,425-428
- [78]Chen, Y., Zhao, N., Huang, M. L..Microstructure and interfacial reactions of Sn-Au-Ag solder joints on Cu and Ni substrates[A],2016,534-537
- [79]Zhao, Ning, Zhong, Yi, Huang, Mingliang, Ma, Haitao, Dong, Wei.Synchrotron radiation in situ study on the solidification of Cu/Sn-58Bi/Cu solder joint under t...[A],2016,264-267
- [80]Zhao, Ning, Deng, Jianfeng, Zhong, Yi, Ma, Haitao, Huang, Mingliang.Interfacial reaction of Ni/Sn-9Zn/Ni solder joint undergoing liquid-solid thermomigration[A],2016,273-276