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个人信息Personal Information
教授
博士生导师
硕士生导师
主要任职：材料科学与工程学院副院长
性别：男
毕业院校：大连理工大学
学位：博士
所在单位：材料科学与工程学院
学科：材料学
办公地点：知远楼B515(新材料大楼)
电子邮箱：zhaoning@dlut.edu.cn
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- [41]A. Kunwar, 马浩然, 马海涛, J.H. Sun, 赵宁, 黄明亮.Corrigendum to “On the increase of intermetallic compound's thickness at the cold side in liquid...[J],Materials Letter,2018,230:76-76
- [42]Kunwar, Anil, Shang, Shengyan, Raback, Peter, Wang, Yunpeng, Givernaud, Julien, Chen, Jun, Ma, Haitao, Song, Xueguan, Zhao, Ning, HT, Zhao, N (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Heat and mass transfer effects of laser soldering on growth behavior of interfacial intermetall...[J],MICROELECTRONICS RELIABILITY,2018,80:55-67
- [43]Ma, Haitao, Haoran, Kunwar, Anil, Shang, Shengyan.Effect of initial Cu concentration on the IMC size and grain aspect ratio in Sn-xCu solders dur...[J],JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2018,29(1):602-613
- [44]Guo, Bingfeng, Kunwar, Anil, Jiang, Chengrong, Zhao, Ning, Sun, Junhao, Huang, Mingliang, Ma, Haitao, Chen, Jun, Wang, Yunpeng, N, Ma, HT (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Synchrotron radiation imaging study on the rapid IMC growth of Sn-xAg solders with Cu and Ni su...[J],JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2018,29(1):589-601
- [45]Zhong, Yi, Zhao, Ning, Dong, Wei, Wang, Yunpeng, Ma, Haitao.Growth mechanism of Cu3Sn grains in the (111)Cu/Sn/Cu micro interconnects[A],2018,1748-1750
- [46]Zhao, Ning, Wang, Mingyao, Zhong, Yi, Ma, Haitao, Yunpeng.Effect of Temperature Gradient on Interfacial Reactions in Cu/Sn-9Zn/Ni Solder Joints during Ag...[A],2018,1744-1747
- [47]Ji, Shengnan, Wang, Chen, Yunpeng, Ma, Haitao, Zhao, Ning.Stability of Multilayered Ag/Ag3Sn/Sn Films Non-cyanide Electroplateded for high-reflective bac...[A],2018,396-399
- [48]Zhang, Shuye, Lin, Tiesong, He, Peng, Zhao, Ning, Huang, Mingliang, Paik, Kyung-Wook, KW (reprint author), Korea Adv Inst Sci & Technol, Dept Mat Sci & Engn, Daejeon 34141, South Korea..A Study on the Bonding Conditions and Nonconductive Filler Contents on Cationic Epoxy-Based Sn-...[J],IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY,2017,7(12):2087-2094
- [49]Zhong, Y., Zhao, N., Liu, C. Y., Dong, W., Qiao, Y. Y., Wang, Y. P., Ma, H. T., N, Dong, W (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Continuous epitaxial growth of extremely strong Cu6Sn5 textures at liquid-Sn/(111)Cu interface ...[J],APPLIED PHYSICS LETTERS,2017,111(22)
- [50]Ma, Haoran, Kunwar, Anil, Huang, Ru, Chen, Jun, Wang, Yunpeng, Zhao, Ning, Haitao, N, Ma, HT (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Size effect on IMC growth induced by Cu concentration gradient and pinning of Ag3Sn particles d...[J],INTERMETALLICS,2017,90:90-96
- [51]Ma, Haoran, Wang, Yunpeng, Chen, Jun, Kunwar, Anil, Haitao, Zhao, Ning, HT, Zhao, N (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Geometrical outline evolution and size-inhibiting interaction of interfacial solder bubbles and...[J],VACUUM,2017,145:103-111
- [52]Zhao, Ning, Deng, Jianfeng, Zhong, Yi, Ma, Haitao, Wang, Yunpeng, Wong, Ching-ping, N, Ma, HT (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Effect of Zn content on interfacial reactions of Ni/Sn-xZn/Ni joints under temperature gradient[J],JOURNAL OF MATERIALS RESEARCH,2017,32(18):3555-3563
- [53]Ma, H.R., Zhao, N., H.T., Chen, J., Wang, Y.P..The effect of reflow temperature on IMC growth in Sn/Cu and Sn0.7Cu/Cu solder bumps during multip...[A],2017,1402-1405
- [54]Zhong, Yi, Zhao, Ning, Dong, Wei, Ma, Haitao, Huang, Mingliang, Yin, Luqiao, Wong, Chingping, N, Ma, HT (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Coupling effect of thermomigration and cross-interaction on evolution of intermetallic compound...[J],JOURNAL OF MATERIALS RESEARCH,2017,32(16):3128-3136
- [55]赵宁, 邓建峰, 殷录桥, 钟毅, Zhao, N (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..热迁移下Ni/Sn-xCu/Ni微焊点钎焊界面金属间化合物的演变[J],金属学报,2017,53(07):861-868
- [56]Yao, Mingjun, Fan, Jun, Zhao, Ning, Xiao, Zhiyi, Yu, Daquan, Ma, Haitao, N, Ma, HT (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China., Yu, DQ (reprint author), Huatian Technol Kunshan Elect Co Ltd, Kunshan 215300.Simplified low-temperature wafer-level hybrid bonding using pillar bump and photosensitive adhe...[J],JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2017,28(12):9091-9095
- [57]Zhao, N., Yao, M. J., Ma, H. T., Wong, C. P., N (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..In situ study on liquid structure of Sn during Sn/Cu liquid-solid interfacial reaction by fluor...[J],JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2017,28(12):8824-8831
- [58]Zhang, Z. J., Huang, M. L., Zhao, N., ML (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Elect Packaging Mat Lab, Dalian 116024, Peoples R China..Comment on "Electric current induced flow of liquid metals: Mechanism and substrate-surface eff...[J],JOURNAL OF APPLIED PHYSICS,2017,121(13)
- [59]Zhao, N., Deng, J. F., Zhong, Y., Huang, M. L., Ma, H. T., N (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Abnormal Intermetallic Compound Evolution in Ni/Sn/Ni and Ni/Sn-9Zn/Ni Micro Solder Joints Unde...[J],JOURNAL OF ELECTRONIC MATERIALS,2017,46(4):1931-1936
- [60]Guo, Bingfeng, Ma, Haitao, Jiang, Chengrong, Wang, Yunpeng, Kunwar, Anil, Zhao, Ning, Huang, Mingliang, HT (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Formation mechanism and kinetic analysis of the morphology of Cu6Sn5 in the spherical solder jo...[J],JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2017,28(7):5398-5406