大连理工大学主页平台管理系统赵宁--赵宁的主页--论文成果

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赵宁

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教授博士生导师硕士生导师

主要任职：材料科学与工程学院副院长

性别：男

毕业院校：大连理工大学

学位：博士

所在单位：材料科学与工程学院

学科：材料学

电子邮箱： zhaoning@dlut.edu.cn

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[21]乔媛媛, 于凤云, 马海涛, 赵宁, 刘春迎.Y.Y. Qiao, F.Y. Yu, N. Zhao*, C.Y. Liu. Characteristics of Cu6Sn5 grains formed on different Cu substrates under temperature gradient[A],2021
[22]乔媛媛, 赵宁, 王云鹏, 马海涛.Y.Y. Qiao, N. Zhao*, C.Y. Liu, C.M.L. Wu, Y.P. Wang, H.T. Ma. Dramatic morphological reservation of prism-type Cu6Sn5 formed on single crystal Cu substrates under temperature gradient[J],Materials Today Communications,2021,23:1-4
[23]常正洋, 赵宁, C.M.L. Wu.Effects of cooling rate and joint size on Sn grain features in Cu/Sn-3.5Ag/Cu solder joints[J],Materialia,2021,14:1-9
[24]Ma, H. R., Dong, C., Zhao, N., Wang, Y. P., Li, X. G., H. T., Chen, J., HT (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Analysis and control of Cu6Sn5 preferred nucleation on single crystal (001)Cu[J],MATERIALS LETTERS,2020,265
[25]Qiao, Y. Y., Zhao, N., Liu, C. Y., Wu, C. M. L., Wang, Y. P., Ma, H. T., N (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Dramatic morphological reservation of prism-type Cu6Sn5 formed on single crystal Cu substrates under temperature gradient[J],MATERIALS TODAY COMMUNICATIONS,2020,23
[26]Yao, Mingjun, Zhao, Ning, Wang, Teng, Yu, Daquan, Xiao, Zhiyi, Ma, Haitao, N, Ma, HT (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China., Yu, DQ (reprint author), Huatian Technol Kunshan Elect Co Ltd, Kunshan 215300.Study of Three-Dimensional Small Chip Stacking Using Low Cost Wafer-Level Micro-bump/B-Stage Adhesive Film Hybrid Bonding and Via-Last TSVs[J],JOURNAL OF ELECTRONIC MATERIALS,2018,47(12):7544-7557
[27]Kunwar, Anil, Ma, Haoran, Haitao, Sun, Junhao, Zhao, Ning, Huang, Mingliang, HT (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..On the increase of intermetallic compound's thickness at the cold side in liquid Sn and SnAg solders under thermal gradient (vol 172, pg 211, 2016)[J],MATERIALS LETTERS,2018,230:76-76
[28]Yao, Mingjun, Zhao, Ning, Wang, Teng, Yu, Daquan, Xiao, Zhiyi, Ma, Haitao, N (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Optimization and Characterization of Low-Temperature Wafer-Level Hybrid Bonding Using Photopatternable Dry Film Adhesive and Symmetric Micro Cu Pillar Solder Bumps[J],IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY,2018,8(10):1855-1862
[29]Zhong, Y., Ma, H. T., Wang, Y. P., Dong, W., Zhao, N., N (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..In situ study on the effect of Cu5Zn8 intermetallic layer on the Cu-Ni cross interaction in Cu/Sn-9Zn/Ni interconnect under temperature gradient[J],MATERIALS CHEMISTRY AND PHYSICS,2018,216:130-135
[30]Shang, Shengyan, Kunwar, Anil, Yao, Jinye, Wang, Yunpeng, Huang, Mingliang, Ma, Haitao, Zhao, Ning, HT (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..All-round suppression of Cu6Sn5 growth in Sn/Cu joints by utilizing TiO2 nanoparticles[J],JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2018,29(18,SI):15966-15972
[31]Ma, H. R., Kunwar, A., Shang, S. Y., Jiang, C. R., Wang, Y. P., H. T., Zhao, N., HT, Zhao, N (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Evolution behavior and growth kinetics of intermetallic compounds at Sn/Cu interface during multiple reflows[J],INTERMETALLICS,2018,96:1-12
[32]Ma, Haoran, Kunwar, Anil, Chen, Jun, Qu, Lin, Wang, Yunpeng, Song, Xueguan, Raback, Peter, Zhao, Ning, Haitao, HT, Zhao, N (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Study of electrochemical migration based transport kinetics of metal ions in for Sn-9Zn alloy[J],MICROELECTRONICS RELIABILITY,2018,83:198-205
[33]Zhao, N., Wang, M. Y., Zhong, Y., Ma, H. T., Y. P., Wong, C. P., N, Ma, HT (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Effect of Zn content on Cu-Ni cross-interaction in Cu/Sn-xZn/Ni micro solder joints[J],JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2018,29(6):5064-5073
[34]Guo, Bingfeng, Kunwar, Anil, Zhao, Ning, Chen, Jun, Wang, Yunpeng, Ma, Haitao, N, Ma, HT (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Effect of Ag3Sn nanoparticles and temperature on Cu6Sn5 IMC growth in Sn-xAg/Cu solder joints[J],MATERIALS RESEARCH BULLETIN,2018,99:239-248
[35]Ma, Haoran, Kunwar, Anil, Liu, Zhiyuan, Chen, Jun, Wang, Yunpeng, Huang, Mingliang, Zhao, Ning, Haitao, N, Ma, HT (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Shielding effect of Ag3Sn on growth of intermetallic compounds in isothermal heating and cooling during multiple reflows[J],JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2018,29(6):4383-4390
[36]Kunwar, Anil, Raback, Peter, Shang, Shengyan, Guo, Bingfeng, Chen, Jun, Wang, Yunpeng, Zhao, Ning, Song, Xueguan, Ma, Haitao, HT, Zhao, N (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Roles of interfacial heat transfer and relative solder height on segregated growth behavior of intermetallic compounds in Sn/Cu joints during furnace cooling[J],INTERMETALLICS,2018,93:186-196
[37]Yao, Mingjun, Zhao, Ning, Yu, Daquan, Xiao, Zhiyi, Ma, Haitao.Process development and reliability for wafer-level 3D IC integration using micro- bump/adhesive hybrid bonding and via-last TSVs[A],2018,241-246
[38]Zhao, Ning, Chen, Shi, Liu, Chunying, Ma, Haitao, Wang, Yunpeng, Zhong, Yi.Growth Behavior of Cu6Sn5 Grains at Sn/(001)Cu Interface by Imposing Temperature Gradient[A],2018,603-606
[39]马海涛, 赵宁, 王云鹏.Stability of multilayered Ag/Ag3Sn/Sn films noncyanide electroplateded for high-reflective back-electrode[A],2018,396-399
[40]A. Kunwar, 马浩然, 马海涛, J.H. Sun, 赵宁, 黄明亮.Corrigendum to “On the increase of intermetallic compound's thickness at the cold side in liquid Sn and SnAg solders under thermal gradient” [Mater. Lett. 172(2016) 211-215][J],Materials Letter,2018,230:76-76

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