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个人信息Personal Information
教授
博士生导师
硕士生导师
性别：男
毕业院校：大连理工大学
学位：博士
所在单位：机械工程学院
电子邮箱：guodm@dlut.edu.cn
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- [521]Guo, D. M., Zhang, M., Jin, Z. J., Zuo, B. X..Particle strengthening of the surface of copper electrode for electrical discharge machining[A],2006,623-628
- [522]Wang, XY, Guo, DM, Xu, WJ, Kato, M, Wu, YB, Kang, RK, XY (reprint author), Dalian Univ Technol, Minist Educ, Key Lab Precis & Nontradit Machining Technol, Dalian 116023, Peoples R China..Energy model in laser processing of a cylindrical grinding wheel[J],13th Conference on Abrasive Technology in China,2006,304-305:33-37
- [523]Liu, J. Y., Guo, D. M., Jin, Z. J., Kang, R. X., JY (reprint author), Dalian Univ Technol, Key Lab Precis & Nontradit Machining Technol, Minist Educ, Dalian 116023, Peoples R China..A suspending abrasives and porous pad model for the analysis of lubrication in chemical mechani...[J],8th Conference on Machining and Advanced Manufacturing Technology in China,2006,315-316:775-778
- [524]Li, XJ, Guo, DM, Ren, R, Jin, ZJ, XJ (reprint author), Dalian Univ Technol, Minist Educ, Key Lab Precis & Nontrad Machining Technol, Dalian, Peoples R China..Research on effects of slurry additives in CuCMP for ULSI manufacturing[J],13th Conference on Abrasive Technology in China,2006,304-305:350-354
- [525]Wang, X. Y., Kang, R. K., Wu, D. J., Guo, D. M., Xu, W. J., Si, M. Y..An experimental study on laser cleaning of larger silicon wafer[A],2006,216-220
- [526]Jia, Z. Y., Wang, X. Y., Guo, D. M., F. J..Strain hysteresis of giant magnetostrictive transducer under varied external stress and magneti...[A],2006,655-660
- [527]Ren, Li, Yang, Rui, Guo, Dongming, Mi, Dahai, R (reprint author), Dalian Univ Technol, Key Lab Precis & Nontradiat Machining Technol, Minist Educ, Dalian 116024, Peoples R China..Concurrent design of heterogeneous object based on method of feasible direction and genetic alg...[J],2nd International Conference on Natural Computation (ICNC 2006),2006,4221:769-778
- [528]Ji, T, Wang, YQ, Jia, ZY, Guo, DM, Li, XJ, T (reprint author), Dalian Univ Technol, Key Lab Precis & Nontradit Machining Technol, Minist Educ, Dalian, Peoples R China..Design and realization of control software of the CNC grinding machine tool for the radome[J],13th Conference on Abrasive Technology in China,2006,304-305:530-534
- [529]Liu, JY, Jin, ZJ, Guo, DM, Kang, RK, JY (reprint author), Dalian Univ Technol, Minist Educ, Key Lab Precis & Nontrad Machining Technol, Dalian 116023, Peoples R China..Effects of suspending abrasives on the lubrication properties of slurry in chemical mechanical ...[J],13th Conference on Abrasive Technology in China,2006,304-305:359-363
- [530]Guo, XG, Jin, ZJ, DM, Kang, R, XG (reprint author), Dalian Univ Technol, Minist Educ, Key Lab Precis & Nontrad Machining Technol, Dalian 116023, Peoples R China..Molecular dynamics analyze on effects of abrasive size and cut depth on the monocrystal silicon...[J],13th Conference on Abrasive Technology in China,2006,304-305:286-289
- [531]Zhang, YX, Kang, RK, Guo, DM, Jin, ZJ, YX (reprint author), Dalian Univ Technol, Key Lab Precis & Nontradit Machining Technol, Minist Educ, Dalian 116024, Peoples R China..Raman microspectroscopy study on the ground surface of monocrystalline silicon wafers[J],13th Conference on Abrasive Technology in China,2006,304-305:241-245
- [532]李庆忠, 郭东明, 康仁科, 于秀坤, Li, Q.(qingzhongli@163.com).复合添加剂在新戊基多元醇酯中极压抗磨特性的研究[J],润滑与密封,2005,6:57-59
- [533]李秀娟, 金洙吉, 康仁科, 郭东明, 苏建修, Li, X..抛光液中缓蚀剂对铜硅片的影响[J],半导体学报,2005,26(11):2259-2263
- [534]冯冬菊, 郭东明, 赵福令.数控超声波机床钻孔中存在的问题及其改善措施[A],2005,1171-1175
- [535]田业冰, 金洙吉, 康仁科, 郭东明.硅片自旋转磨削的运动几何学分析[J],中国机械工程,2005,16(20):1798-1801
- [536]李秀娟, 金洙吉, 康仁科, 郭东明, Li, X.-J.(dlutlxj@126.com).磨料对铜化学机械抛光过程的影响研究[J],摩擦学学报,2005,25(5):431-435
- [537]沈永康, 郭东明, 王敏杰, 宋满仓, 于同敏.覆晶封装底胶充填流动研究[J],纳米技术与精密工程,2005,3(3):185-188
- [538]王福吉, 郭东明, 张永顺, 刘巍, 贾振元.超磁致伸缩薄膜磁致伸缩耦合机理的有限元分析[J],中国机械工程,2005,16(18):1654-1658
- [539]Ren, L, Yang, R, Mi, DH, Guo, DM.Topology optimization design for micro compliant mechanism with two materials[A],2005,6042
- [540]罗忠良, 王克运, 康仁科, 郭东明.基于案例推理系统中案例检索算法的探索[J],计算机工程与应用,2005,41(25):230-232