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个人信息Personal Information
讲师
硕士生导师
性别：女
毕业院校：大连理工大学
学位：博士
所在单位：集成电路学院
联系方式：mhr@dlut.edu.cn （微信：Mahr-DLUT）
电子邮箱：mhr@dlut.edu.cn
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微电子封装材料与技术
- Dong, Chong, Shang, Min, 郭莹, Chen, Xiangxu, 张军, Changlong, 马浩然, 马海涛.Significant Effect of Temperature and Solders on the Growth Behavior of CU6Sn5on (110) Cu Single Crystal[A],2021 22nd International Conference on Electronic Packaging Technology, ICEPT 2021,2022
- 姚金冶, 王立, 郭世浩, 李孝夫, 陈祥序, 赏敏, 马浩然, 马海涛, Ma, Haitao.First-Principles Study of Cu Addition on Mechanical Properties of Ni3Sn4-Based Intermetallic Compounds[J],METALS,2024,14(1)
- Zhang, Liyuan, 张力元, 缑敏, 马浩然, 夏晓川, 梁红伟, Ma, Haoran, Xia, Xiaochuan.Laser Etching Process of TSV and Reliability Analysis of TSV-based IC structure by Finite Element Simulation[A],2023 24TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, ICEPT,2011
- 赏敏, 姚金冶, 张丹, 苏小林, 马海涛, 王云鹏, 马浩然, Ma, Haitao, Wang, Yunpeng.Preparation and soldering performance of SAC305@Sn-bi Core-shell solder balls based on eutectic co-deposition[J],MATERIALS CHARACTERIZATION,2024,211
- 潘帅屹, 许慧敏, 谭昕, Xu, Huimin, Tan, Xin, 马浩然, 夏晓川, 梁红伟, Ma, Haoran.Reliability Modeling of High Power DUV LED Chips Based on New Thin Film Packaging Technology[A],2023 24TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, ICEPT,2011
- Liang, Shuibao, Wei, Cheng, Kunwar, Anil, Subedi, Upadesh, Jiang, Han, 马浩然, Ke, Changbo, Kunwar.Phase field modelling combined with data-driven approach to unravel the orientation influenced growth of interfacial Cu6Sn5 intermetallics under electric current stressing[J],SURFACES AND INTERFACES,2023,37
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