马浩然
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个人信息Personal Information
副教授
硕士生导师
性别：女
毕业院校：大连理工大学
学位：博士
所在单位：集成电路学院
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研究领域
集成电路先进封装材料与技术
- Dong, Chong.Shang, Min,郭莹,Chen, Xiangxu,张军,Dong, Changlong,马浩然,马海涛.Significant Effect of Temperature and Solders on the Growth Behavior of CU6Sn5on (110) Cu Single Crystal[A],2021 22nd International Conference on Electronic Packaging Technology, ICEPT 2021,2022
- 姚金冶.马浩然,马海涛,Ma, Haitao.王立,郭世浩,李孝夫,陈祥序,赏敏.First-Principles Study of Cu Addition on Mechanical Properties of Ni3Sn4-Based Intermetallic Compounds[J],METALS,2024,14(1)
- Zhang, Liyuan,张力元.马浩然,夏晓川,梁红伟,Ma, Haoran; Xia, Xiaochuan.缑敏.Laser Etching Process of TSV and Reliability Analysis of TSV-based IC structure by Finite Element Simulation[A],2023 24TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, ICEPT,2023
- 赏敏.马海涛,王云鹏,马浩然,Ma, Haitao; Wang, Yunpeng.姚金冶,张丹,苏小林.Preparation and soldering performance of SAC305@Sn-bi Core-shell solder balls based on eutectic co-deposition[J],MATERIALS CHARACTERIZATION,2024,211
- 潘帅屹.Xu, Huimin,Tan, Xin,马浩然,夏晓川,梁红伟,Ma, Haoran.许慧敏,谭昕.Reliability Modeling of High Power DUV LED Chips Based on New Thin Film Packaging Technology[A],2023 24TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, ICEPT,2023
- Liang, Shuibao.Wei, Cheng,Kunwar, Anil,Subedi, Upadesh,Jiang, Han,马浩然,Ke, Changbo,Ke, Changbo; Kunwar, Anil.Phase field modelling combined with data-driven approach to unravel the orientation influenced growth of interfacial Cu6Sn5 intermetallics under electric current stressing[J],SURFACES AND INTERFACES,2023,37
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