马浩然
|
个人信息Personal Information
副教授
硕士生导师
性别：女
毕业院校：大连理工大学
学位：博士
所在单位：集成电路学院
联系方式：
电子邮箱：
扫描关注
- [1]Dong, Chong.Shang, Min,郭莹,Chen, Xiangxu,张军,Dong, Changlong,马浩然,马海涛.Significant Effect of Temperature and Solders on the Growth Behavior of CU6Sn5on (110) Cu Single Crystal[A],2021 22nd International Conference on Electronic Packaging Technology, ICEPT 2021,2022
- [2]姚金冶.马浩然,马海涛,Ma, Haitao.王立,郭世浩,李孝夫,陈祥序,赏敏.First-Principles Study of Cu Addition on Mechanical Properties of Ni3Sn4-Based Intermetallic Compounds[J],METALS,2024,14(1)
- [3]Zhang, Liyuan,张力元.马浩然,夏晓川,梁红伟,Ma, Haoran; Xia, Xiaochuan.缑敏.Laser Etching Process of TSV and Reliability Analysis of TSV-based IC structure by Finite Element Simulation[A],2023 24TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, ICEPT,2023
- [4]赏敏.马海涛,王云鹏,马浩然,Ma, Haitao; Wang, Yunpeng.姚金冶,张丹,苏小林.Preparation and soldering performance of SAC305@Sn-bi Core-shell solder balls based on eutectic co-deposition[J],MATERIALS CHARACTERIZATION,2024,211
- [5]潘帅屹.Xu, Huimin,Tan, Xin,马浩然,夏晓川,梁红伟,Ma, Haoran.许慧敏,谭昕.Reliability Modeling of High Power DUV LED Chips Based on New Thin Film Packaging Technology[A],2023 24TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, ICEPT,2023
- [6]Liang, Shuibao.Wei, Cheng,Kunwar, Anil,Subedi, Upadesh,Jiang, Han,马浩然,Ke, Changbo,Ke, Changbo; Kunwar, Anil.Phase field modelling combined with data-driven approach to unravel the orientation influenced growth of interfacial Cu6Sn5 intermetallics under electric current stressing[J],SURFACES AND INTERFACES,2023,37
- [7]董冲.马浩然,马海涛,王云鹏,Ma, Haitao.Nucleation and growth of intermetallic compounds on the prefabricated Cu6Sn5 layer[J],MATERIALS CHEMISTRY AND PHYSICS,2023,296
- [8]Zhang, Dan,张丹.马浩然,Ma, Haitao,Wang, Yunpeng,Ma, Haitao; Ma, Haoran.董冲,郭天浩,马海涛,王云鹏.Enhanced Shear Strength of Sn-Bi/(111)Cu Joints by Refined Distribution of Bi in the Composite Solder[J],JOURNAL OF ELECTRONIC MATERIALS,2024,53(8):4539-4543
- [9]Chen, Le.马浩然,Liu, Caiyun,Tai, Jiajin,梁红伟,Yin, Hong,Liang, Hongwei; Yin, Hong.王德煜,韩中元.Covalent Heteroepitaxy of Large-Area Vertical Hexagonal Boron Nitride for High-Temperature VUV Photodetectors[J],Laser and Photonics Reviews,2024
- [10]Liu, Di,刘笛.Bai, Tianyue,Qiao, Yuanyuan,马浩然,Dong, Wei,Zhao, Ning,Ma, Haoran; Qiao, Yuanyuan; Zhao, Ning.白天越,乔媛媛,董伟,赵宁.Laser jet solder ball bonding of SAC305/Cu BGA joints: Microstructure, temperature field simulation and mechanical property[J],MATERIALS CHARACTERIZATION,2024,215