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Professor Supervisor of Doctorate Candidates Supervisor of Master's Candidates

Paper Publications

[91]Gao, Shang, Huang, Han, H (reprint author), Univ Queensland, Sch Mech & Min Engn, Brisbane, Qld 4072, Australia..Recent advances in micro- and nano-machining technologies[J],FRONTIERS OF MECHANICAL ENGINEERING,2017,12(1,SI):18-32
[92]高尚, 康仁科.硅片超精密磨削减薄工艺基础研究[J],机械工程学报,2015,7:52-52
[93]Gao, Shang, Wu, Yueqin, Kang, Renke, Huang, Han, RK (reprint author), Dalian Univ Technol, Minist Educ, Key Lab Precis & Nontradit Machining Technol, Dalian 116024, Peoples R China., Huang, H (reprint author), Univ Queensland, Sch Mech & Min Engn, Brisbane, Qld 4072, Australia..Nanogrinding induced surface and deformation mechanism of single crystal beta-Ga2O3[J],MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING,2018,79:165-170
[94]朱祥龙, 李俊卿, 董志刚, 康仁科, 高尚, 郭东明.Design of Ultra-precision Machine for Integrated Grinding and Polishing of Silicon Wafers[A],2018
[95]Wu, Y. Q., Gao, S., Huang, H., YQ, Huang, H (reprint author), Univ Queensland, Sch Mech & Min Engn, Brisbane, Qld 4072, Australia..The deformation pattern of single crystal β-Ga2O3 under nanoindentation[J],Materials Science in Semiconductor Processing,2017,71(-):321-325
[96]朱祥龙, 高尚, 康仁科, 董志刚, 崔岩.全日制专业型硕士实践能力培养体系之探析[J],实验室科学,2017,20(5):229-232
[97]王紫光, 高尚, 朱祥龙, 董志刚, 康仁科, Kang, Ren-Ke(Kangrk@dlut.edu.cn).硅片低损伤磨削砂轮及其磨削性能[J],光学精密工程,2017,25(10):2689-2696
[98]Gao, Shang, Huang, Han, Zhu, Xianglong, Kang, Renke, RK (reprint author), Dalian Univ Technol, Sch Mech Engn, Inst Adv Mfg Technol, 2 Linggong Rd, Dalian 116024, Peoples R China..Surface integrity and removal mechanism of silicon wafers in chemo-mechanical grinding using a ...[J],MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING,2017,63:97-106
[99]高尚, 王紫光, 张璧, 朱祥龙, 康仁科, 郭东明, Kang, Renke(kangrk@dlut.edu.cn).微晶玻璃超精密磨削的表面/亚表面损伤及其材料去除机理研究[J],机械工程学报,2017,53(7):180-188
[100]Gao, Shang, Wang, Zi-Guang, Zhang, Bi, Dong, Zhi-Gang, Kang, Ren-Ke, RK (reprint author), Dalian Univ Technol, Key Lab Precis & Nontradit Machining Technol, Minist Educ, Dalian 116024, Peoples R China..Surface integrity and removal mechanism in grinding sapphire wafers with novel vitrified bond d...[J],MATERIALS AND MANUFACTURING PROCESSES,2017,32(2):121-126

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