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Paper Publications

[81]李子源, Shang GAO, Renke Kang, 李洪刚, Maggie Guo.A comparative study of lapping and grinding induced surface/subsurface damage of silicon wafers a...[J],International Journal of Abrasive Technology,2020,10(2):122-133
[82]高尚, 吴跃勤, 王紫光, 康仁科, 耿宗超.石英玻璃超精密磨削加工的表面完整性研究[J],机械工程学报,2019,55(5):186-195
[83]王紫光, 康仁科, 周平, 高尚, 董志刚.单晶硅反射镜的超精密磨削工艺[J],光学精密工程,2019,27(5):1087-1095
[84]Cai, Linquan, Guo, Xiaoguang, Gao, Shang, Li, Zhiyuan, Kang, Renke, S (reprint author), Dalian Univ Technol, Key Lab Precis & Nontradit Machining Technol, Minist Educ, Dalian 116024, Peoples R China..Material removal mechanism and deformation characteristics of AIN ceramics under nanoscratching[J],CERAMICS INTERNATIONAL,2019,45(16):20545-20554
[85]Gao, Shang, Dong, Zhigang, Kang, Renke, Zhang, Bi, Guo, Dongming, S (reprint author), Dalian Univ Technol, Sch Mech Engn, Inst Adv Mfg Technol, 2 Linggong Rd, Dalian 116024, Peoples R China..Warping of silicon wafers subjected to back-grinding process[J],PRECISION ENGINEERING-JOURNAL OF THE INTERNATIONAL SOCIETIES FOR PRECISION ENGINEERING AND NANOTECHNOLOGY,2015,40:87-93
[86]Wu, Y. Q., Gao, S., Kang, R. K., Huang, H., YQ, Huang, H (reprint author), Univ Queensland, Sch Mech & Min Engn, Brisbane, Qld 4072, Australia..Deformation patterns and fracture stress of beta-phase gallium oxide single crystal obtained us...[J],JOURNAL OF MATERIALS SCIENCE,2019,54(3):1958-1966
[87]Gao, Shang, Huang, Han, H (reprint author), Univ Queensland, Sch Mech & Min Engn, Brisbane, Qld 4072, Australia..Recent advances in micro- and nano-machining technologies[J],FRONTIERS OF MECHANICAL ENGINEERING,2017,12(1,SI):18-32
[88]高尚, 康仁科.硅片超精密磨削减薄工艺基础研究[J],机械工程学报,2015,7:52-52
[89]Gao, Shang, Wu, Yueqin, Kang, Renke, Huang, Han, RK (reprint author), Dalian Univ Technol, Minist Educ, Key Lab Precis & Nontradit Machining Technol, Dalian 116024, Peoples R China., Huang, H (reprint author), Univ Queensland, Sch Mech & Min Engn, Brisbane, Qld 4072, Australia..Nanogrinding induced surface and deformation mechanism of single crystal beta-Ga2O3[J],MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING,2018,79:165-170
[90]朱祥龙, 李俊卿, 董志刚, 康仁科, 高尚, 郭东明.Design of Ultra-precision Machine for Integrated Grinding and Polishing of Silicon Wafers[A],2018

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