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Professor Supervisor of Doctorate Candidates Supervisor of Master's Candidates

Paper Publications

[61]Shang GAO, Renke Kang, Dong Zhigang, zhangbi.Edge chipping of silicon wafers in diamond grinding[J],INTERNATIONAL JOURNAL OF MACHINE TOOLS MANUFACTURE,2022,64:31-37
[62]Dong Zhigang, zhangqian, Liu, Haijun, Renke Kang, Shang GAO.Effects of taping on grinding quality of silicon wafers in backgrinding[J],FRONTIERS OF MECHANICAL ENGINEERING,2022,16(3):559-569
[63]Shang GAO, Li, Honggang, Renke Kang, zhangyu, Dong Zhigang.Effect of Strain Rate on the Deformation Characteristic of AlN Ceramics under Scratching[J],MICROMACHINES,2022,12(1)
[64]Shang GAO, Dong Zhigang, Renke Kang, zhangbi, Dongming Guo.Warping of silicon wafers subjected to back-thinning process[J],PRECISION ENGINEERING JOURNAL OF THE AMERICAN SOCIETY FOR PRECISION ENGINEE,2022,40(-):87-93
[65]Cai, Linquan, Maggie Guo, Shang GAO, lizhiyuan, Renke Kang.Material removal mechanism and deformation characteristics of AIN ceramics under nanoscratching[J],CERAMICS INTERNATIONAL,2022,45(16):20545-20554
[66]Shang GAO, Renke Kang, Maggie Guo.Grinding performance of diamond grinding tools for sapphire crystal[A],17th International Symposium on Advances in Abrasive Technology, ISAAT 2014,2022,117(-):544-548
[67]Wu, Y. Q., Shang GAO, Hao Huang.The deformation pattern of single crystal β-Ga2O3 under nanoindentation[J],MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING,2022,71(-):321-325
[68]李子源, Shang GAO, Renke Kang, 李洪刚, Maggie Guo.A comparative study of lapping and grinding induced surface/subsurface damage of silicon wafers a...[J],International Journal of Abrasive Technology,2022,10(2):122-133
[69]Shang GAO, Renke Kang, Dong Zhigang, Dongming Guo.工件旋转法磨削硅片的亚表面损伤分布[J],机械工程学报,2022,3:88-94
[70]Shang GAO, 王紫光, Renke Kang, Dong Zhigang, zhangbi.工件旋转法磨削硅片的磨粒切削深度模型[J],机械工程学报,2022,17:86-93

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