Personal Information
Professor Supervisor of Doctorate Candidates Supervisor of Master's Candidates
Paper Publications
- [1] Liu, Haijun.Dong Zhigang,Renke Kang,Zhou Ping,Shang GAO.ANALYSIS OF FACTORS AFFECTING GRAVITY-INDUCED DEFLECTION FOR LARGE AND THIN WAFERS IN FLATNESS MEASUREMENT USING THREE-POINT-SUPPORT METHOD[J],Metrology and Measurement Systems,2022,22(4):531-546
- [2] 张玉.Renke Kang,Shang GAO,Huang, Jinxing,zhuxianglong.A new model of grit cutting depth in wafer rotational grinding considering the effect of the grinding wheel, workpiece characteristics, and grinding parameters[J],PRECISION ENGINEERING-JOURNAL OF THE INTERNATIONAL SOCIETIES FOR PRECISION ENGINEERING AND NANOTECHNOLOGY,2022,72:461-468
- [3] Yang Guolin.Dong Zhigang,Shang GAO,鲍岩,Renke Kang,Dongming Guo.A novel reverse helical milling process for reducing push-out delamination of CFRP[J],COMPOSITE STRUCTURES,2022,253
- [4] Shang GAO.Dong Zhigang,Renke Kang,Dongming Guo.Design and evaluation of soft abrasive grinding wheels for silicon wafers[J],PROCEEDINGS OF THE INSTITUTION OF MECHANICAL ENGINEERS PART B JOURNAL OF EN,2022,227(B4):578-586
- [5] Wu, Y. Q..Shang GAO,Renke Kang,Hao Huang.Deformation patterns and fracture stress of beta-phase gallium oxide single crystal obtained using compression of micro-pillars[J],JOURNAL OF MATERIALS SCIENCE,2022,54(3):1958-1966
- [6] Shang GAO.Wu, Yueqin,Renke Kang,Huang, Han.Nanogrinding induced surface and deformation mechanism of single crystal beta-Ga2O3[J],MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING,2022,79:165-170
- [7] Dong Zhigang.Shang GAO,Zhou Ping,Renke Kang,Dongming Guo.Grinding performance evaluation of the developed chemo-mechanical grinding (CMG) tools for sapphire substrate[J],Advanced materials research,2022,565:105-110
- [8] Liu, Zhiqiang.Renke Kang,Liu, Haijun,Dong Zhigang,鲍岩,Shang GAO,zhuxianglong.FEM-based optimization approach to machining strategy for thin-walled parts made of hard and brittle materials[J],INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY,2022,110(5-6):1399-1413
- [9] zhuxianglong.于力,Dong Zhigang,Renke Kang,Shang GAO,Li, Liansheng.Grinding Marks in Back Grinding of Wafer with Outer Rim[J],PROCEEDINGS OF THE INSTITUTION OF MECHANICAL ENGINEERS PART C JOURNAL OF ME,2022,234(16):3195-3206
- [10] Shang GAO.Renke Kang,Dong Zhigang,张璧.Edge chipping of silicon wafers in diamond grinding[J],INTERNATIONAL JOURNAL OF MACHINE TOOLS MANUFACTURE,2022,64:31-37