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个人信息Personal Information
教授
博士生导师
硕士生导师
性别：男
毕业院校：大连理工大学
学位：博士
所在单位：机械工程学院
电子邮箱：guodm@dlut.edu.cn
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- [401]张永顺, 于宏海, 阮晓燕, 王楠, 郭东明.新型肠道胶囊式机器人的运动动态特性[J],机械工程学报,2009,45(8):18-23
- [402]Yu, Z. Y., Zhang, Y., Li, J., Luan, Zhao, F., Guo, D., ZY (reprint author), Dalian Univ Technol, Sch Mech Engn, Dalian 116024, Liaoning, Peoples R China..High aspect ratio micro-hole drilling aided with ultrasonic vibration and planetary movement of...[J],CIRP ANNALS-MANUFACTURING TECHNOLOGY,2009,58(1):213-216
- [403]吴东江, 牛方勇, 张强, 郭东明, Wu, D., Key Laboratory for Precision, Non-traditional Machining Technology of the Ministry of Education, Dalian University of Technology, Dalian, Liaoning, 116024, China.硼硅酸盐玻璃薄片CO2激光反向弯曲研究[J],中国机械工程,2009,20(14):1665-1668
- [404]Huo, F. W., Guo, D. M., Kang, R. K., Jin, Z. J..Characteristics of the Wheel Surface Topography in Ultra-precision Grinding of Silicon Wafers[A],2009,389-390:36-41
- [405]Guo, D. M., Tian, Y. B., Kang, R. K., Zhou, L., Lei, M. K..Material Removal Mechanism of Chemo-mechanical Grinding (CMG) of Si Wafer by Using Soft Abrasiv...[A],2009,389-390:459-+
- [406]Guo, D. M., Liu, R. H., Kang, R. K., Jin, Z. J..Study on adhesion removal model in CMP SiO(2) ILD[A],2009,389-390:475-480
- [407]Qin, N., Guo, D. M., Kang, R. K., Huo, F. W..Effect of Conditioning Parameters on Surface Non-uniformity of Polishing Pad in Chemical Mechan...[A],2009,389-390:498-503
- [408]Kang, R., Gao, S., Jin, Z., Guo, D., R.(gaoshangf@gmail.coml).Study on grinding performance of soft abrasive wheel for silicon wafer[J],Key Engineering Materials,2009,416:529-534
- [409]Qin N., Guo D.M., Kang R.K., Huo F.W., Qin, N., Key Laboratory for Precision, Non-traditional Machining Technology, Ministry of Education, Dalian University of Technology, Dalian 116024, China, email: tinaspirit@163.com.Effect of conditioning parameters on surface non-uniformity of polishing pad in chemical mechanic...[J],Key Engineering Materials,2009,389-390:498-503
- [410]Zhang, Zhenyu, Guo, Dongming, Gao, Hang, Kang, Renke, Zhou, Hongxiu, ZY (reprint author), Dalian Univ Technol, Minist Educ, Key Lab Precis & Nontradit Machining Technol, Dalian 116024, Peoples R China..Optical characterization of hydrogen-free CeO2 doped DLC films deposited by unbalanced magnetro...[J],APPLIED SURFACE SCIENCE,2008,255(5):2655-2659
- [411]张振宇, 郭东明, 康仁科, 高航, 李岩, Zhang, Z.(zzy@dlut.edu.cn).软脆功能晶体碲锌镉化学机械抛光[J],机械工程学报,2008,44(12):215-220,225
- [412]张永顺, 于宏海, 王楠, 杨振强, 郭东明, Zhang, Y.-S..胶囊式微型机器人驱动转矩的研究[J],机器人,2008,30(6):516-520,527
- [413]李庆忠, 张然, 郭东明.非离子型活性剂在ULSI碱性Cu抛光液中的性能[J],半导体技术,2008,33(11):972-975
- [414]Wang Xuyue, Xu Wenji, Lei Mingkai, Guo Dongming.Laser Milling of Al(2)O(3) Ceramic Based on Deteriorative Layer Controlled[A],2008,83-86:1-6
- [415]Sun, Y., Li, D., Ren, F., Guo, Y.(Yuwen.Sun@dlut.edu.cn).Predictive Force Model Based Variable Feedrate Scheduling for High-Efficiency NC machining[J],Lecture Notes in Computer Science (including subseries Lecture Notes in Artificial Intelligence and Lecture Notes in Bioinformatics),2008,5315 LNAI(PART 2):1076-1085
- [416]Zhang, Zhenyu, Gao, Hang, Jie, Wanqi, Guo, Dongming, Kang, Renke, Li, Yan, ZY (reprint author), Dalian Univ Technol, Minist Educ, Key Lab Precis & Non Tradit Machining Technol, Dalian 116024, Peoples R China..Chemical mechanical polishing and nanomechanics of semiconductor CdZnTe single crystals[J],SEMICONDUCTOR SCIENCE AND TECHNOLOGY,2008,23(10)
- [417]Qiao, Y.P., Kang, R.K., Jin, Z.J., Guo, D.M..The characteristics of surface residual stresses by plane grinding invar and the effects of them ...[A],2008,53-54:293-298
- [418]Guo, D.M., Qin, N., Kang, R.K., Jin, Z.J..Novel measurement technique on 3D surface topography of polishing pad[A],2008,53-54:265-272
- [419]Su, J.X., Chen, X.Q., Du, Guo, D.M., Kang, R.K..Analyzing on nonuniformity of material removal in silicon wafer CMP based on abrasive movement tr...[A],2008,53-54:119-124
- [420]Xu, C., Guo, D. M., Kang, R. K., Jin, Z. J., Huo, F. W..Friction-based in Situ Endpoint Detection of Copper CMP Process[A],2008,53-54:125-130