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杜立群
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Professor Supervisor of Doctorate Candidates Supervisor of Master's Candidates
Paper Publications
[181]闫卫平, 杜立群, 邝永变, 席文柱.Ni薄膜热敏电阻的研究[J],仪器仪表学报,2004,25(z1):308-309
[182]闫卫平, 席文柱, 邝永变, 杜立群.Ni薄膜热敏电阻的研究[A],2004,308-309
[183]刘大震, 杜立群, 闫卫平, 郭吉洪.PCR生物芯片微反应腔的制作及其热分析[A],2003,321-323,327
[184]席文柱, 闫卫平, 杜立群, 郭吉洪.硅基PCR生物芯片微型加热器及温度传感器的研究[A],2003,332-334,337
[185]席文柱, 郭吉洪, 闫卫平, 杜立群.硅基PCR生物芯片微型加热器及温度传感器的研究[J],微纳电子技术,2003,40(7):332-334,337
[186]Du Liqun, Hao Yongping, Liu Shuangjie, Yang Tong, Zhao Ming, Luo Lei, Tao Yousheng, Chen Shengli.Stress reduction method in fabrication of a multi-scale inertial switch with ultra-high aspect ra...[J],Microsystem Technologies,2017,23(6):1867-1877
[187]杜立群, 宋磊, 刘文涛, 喻立川.金属基底上三维可动微机构的制作,纳米技术与精密工程,2009,7(1):36-40
[188]杜立群, 陈胜利, 陶友胜, 罗磊, 赵明, 刘双杰.跨尺度、高深宽比惯性微开关制作工艺研究,电加工与模具,2016,4:26-29
[189]Chang Song, Weitai Wang, Wen Zhao, Heqing Zhu, Wenjun Zhao, Liqun Du, Liqun Du.Effectiveness of stress release geometries on reducing residual stress in electroforming metal mi...,Journal of Micromechanics and Microengineering,2018,28(4)
[190]Zhang Xiaolei, Xu Zheng, Du Liqun, Du Liqun.The effect of soft bake on adhesion property between SU-8 photoresist and Ni substrate by molecul...,Journal of Applied Polymer Science,2019,127(6):4456-4462
total211 19/22
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