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个人信息Personal Information
教授
博士生导师
硕士生导师
性别：男
毕业院校：大连理工大学
学位：博士
所在单位：机械工程学院
学科：机械制造及其自动化
办公地点：大连理工大学机械工程学院知方楼5009
联系方式：pzhou@dlut.edu.cn
电子邮箱：pzhou@dlut.edu.cn
扫描关注
- [21]Di, Hongyu, 周平, 郭东明.Study on Chemical-Mechanical Synergies in Polishing of Ruthenium[A],2024 Conference of Science and Technology for Integrated Circuits, CSTIC 2024,2024
- [22]闫英, 刘秋雨, 何乃鹏, 张正宇, Li, Jiarun, 周平.Influence of rectangular substrate chamfer on edge bead effect of a spin-coated thin film[J],Physics of Fluids,35(5)
- [23]何涛, 董晋彤, Zhang, Qiangqiang, 闫英, 周平.Numerical Simulation of a New Designed Mechanical Seals with Spiral Groove Structures[J],LUBRICANTS,2024,11(2)
- [24]Wang, Ziguang, Yan, Feng, Zhang, Yu, Ma, Jiaheng, 周平, Kang, Chengwei, Sha, Zhihua, Shengfang.The material deformation modes of monocrystalline gallium antimonide (GaSb) under nano-scratching[J],Frontiers in Materials,2024,10
- [25]Liu, Xubao, 孟磊, 董晋彤, 郭雨轩, He, Tao, 闫英, 周平.Effects of axial offset and deflection on load-bearing characteristics of the permanent magnet be...[J],Engineering Failure Analysis,2024,146
- [26]周平, 侯长余, 孟磊, Shi, Haosong, Wang, Lin, Di, Hongyu, 郭东明.A quantitative study of removal mechanism of copper polishing based on a single pad-asperity poli...[J],International Journal of Mechanical Sciences,2024,239
- [27]Li, Xiaodong, 孟磊, 周平, 闫英.多层光纤线包结构稳定性高效计算模型与分析[J],Acta Armamentarii,2024,45(8):2554-2563
- [28]Zhao, Bingyao, 黄宁, Dai, Siyang, 周平.Study of Prefabricated Crack Propagation on Monocrystalline Silicon Surfaces for Grinding Damage ...[J],MATERIALS,2024,17(15)
- [29]Li, Ming, 郭晓光, 康仁科, 郭东明, 周平.Study on the transformation and control mechanism of amorphous damage during the grinding process...[J],Tribology International,187
- [30]侯长余, 邸宏宇, 王冀, 郭东明, 周平.Effect of Viscoelastic Characteristics on the Real Contact Area of Polishing Pad Surface[J],ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY,13(4)
- [31]方子铿, 李承航, 罗想, 闫英, 周平.Bubble Defect Generation Mechanism in Slot Die Coating of High-Viscosity Fluids[J],ACS APPLIED MATERIALS & INTERFACES,16(9):11890-11900
- [32]Pan, Yuhang, 刘旭保, Qiao, Yajuan, Wang, Yonghao, 周平.Real-time prediction of grinding surface roughness based on multi-sensor signal fusion[J],International Journal of Advanced Manufacturing Technology,127(11-12):5847-5861
- [33]闫英, 罗想, 李承航, 方子铿, 李贺男, Zhang, Su, Pang, Ran, Wang, Chaowei, 周平.Effect of Temperature Gradient on Particle Distribution of Phosphor Film During Curing[J],IEEE Transactions on Electron Devices,70(9):4766-4771
- [34]韩晓龙, 慕卿, 金洙吉, Niu, Lin, 周平.Surface hydroxylation process of YAG crystal in aqueous solution[J],Optics Express,31(6):10038-10051
- [35]鲁云祥, Wang, Bo, Zhang, Hui, Deng, Lifen, Song, Yi, Jian, Nishimura, Kazhihito, Jiang, Nan, 周平.Understanding of the adhesive strength enhancement mechanisms of bilayer diamond film at nanoscal...[J],Diamond and Related Materials,137
- [36]董晋彤, 闫英, 周平.An Investigation into the Deterioration of Copper Surface Quality in Plasma Electrolytic Polishin...[J],Journal of the Electrochemical Society,2024,170(6)
- [37]祁永年, 仉硕华, 郭晓光, Wang, Hao, Li, Ming, 周平, 郭东明.Reversible densification and cooperative atomic movement induced "compaction" in vitreous silica:...[J],Journal of Materials Science,2024,58(23):9515-9532
- [38]黄宁, 周平, Goel, Saurav.Microscopic stress analysis of nanoscratch induced sub-surface defects in a single-crystal silico...[J],Precision Engineering,2024,82:290-303
- [39]Li, Ming, 郭晓光, 黄宁, Yang, Yanyu, 康仁科, 郭东明, 周平.Dislocation slip mechanism and prediction method during the ultra-precision grinding process of m...[J],Materials Science in Semiconductor Processing,2024,177
- [40]杨恪, 邸宏宇, 侯长余, 黄宁, 周平.Surface microtopography evolution of monocrystalline silicon in chemical mechanical polishing[J],Journal of Materials Processing Technology,2024,328