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Shang GAO
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Professor Supervisor of Doctorate Candidates Supervisor of Master's Candidates
Paper Publications
[41]Renke Kang, Shang GAO, jinzhuji, Dongming Guo.Study on Grinding Performance of Soft Abrasive Wheel for Silicon Wafer[A],ADVANCES IN GRINDING AND ABRASIVE TECHNOLOGY XV,2022,416:529-534
[42]Renke Kang, Shang GAO, jinzhuji, Dongming Guo.Study on grinding performance of soft abrasive wheel for silicon wafer[J],KEY ENGINEERING MATERIALS,2022,416:529-534
[43]Shang GAO, Renke Kang, zhuxianglong, Dongming Guo.Surface and subsurface integrity of glass-ceramics induced by ultra-precision grinding[A],18th International Symposium on Advances in Abrasive Technology, ISAAT 2015,2022
[44]Shang GAO, Renke Kang, Dong Zhigang, zhangbi, Wang, Zi-Guang.Surface integrity and removal mechanism in grinding sapphire wafers with novel vitrified bond d...[J],MATERIALS AND MANUFACTURING PROCESSES,2022,32(2):121-126
[45]Dong Zhigang, Shang GAO, Huang, Han, Renke Kang, Wang, Ziguang.Surface integrity and removal mechanism of chemical mechanical grinding of silicon wafers using...[J],INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY,2022,83(5-8):1231-1239
[46]Shang GAO, Huang, Han, zhuxianglong, Renke Kang.Surface integrity and removal mechanism of silicon wafers in chemo-mechanical grinding using a ...[J],MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING,2022,63:97-106
[47]Shang GAO, Renke Kang, Dong Zhigang.Surface layer damage of quartz glass induced by ultra-precision grinding with different grit size[A],The Second International Conference on Applied Engineering, Materials and Mechanics (ICAEMM 2017),2022,872:19-24
[48]Renke Kang, Zeng, Y.F., Shang GAO, Dong Zhigang, Dongming Guo.Surface layer damage of silicon wafers sliced by wire saw process[J],Advanced materials research,2022,797:685-690
[49]Shang GAO, Huang, Han.Recent advances in micro- and nano-machining technologies[J],机械工程前沿,2022,12(1,SI):18-32
[50]Liu, H.J., Renke Kang, Shang GAO, Zhou Ping, Tong, Y., Dongming Guo.Development of a measuring equipment for silicon wafer warp[J],Advanced materials research,2022,797:561-565
total114 5/12
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