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Professor Supervisor of Doctorate Candidates Supervisor of Master's Candidates

Paper Publications

[51]Shang GAO, Dong Zhigang, Renke Kang, zhangbi, Dongming Guo.Warping of silicon wafers subjected to back-grinding process[J],PRECISION ENGINEERING JOURNAL OF THE AMERICAN SOCIETY FOR PRECISION ENGINEE,2022,40:87-93
[52]Liu, Haijun, Dong Zhigang, Renke Kang, Zhou Ping, Shang GAO.ANALYSIS OF FACTORS AFFECTING GRAVITY-INDUCED DEFLECTION FOR LARGE AND THIN WAFERS IN FLATNESS ...[J],Metrology and Measurement Systems,2022,22(4):531-546
[53]zhangyu, Renke Kang, Shang GAO, Huang, Jinxing, zhuxianglong.A new model of grit cutting depth in wafer rotational grinding considering the effect of the grin...[J],PRECISION ENGINEERING-JOURNAL OF THE INTERNATIONAL SOCIETIES FOR PRECISION ENGINEERING AND NANOTECHNOLOGY,2022,72:461-468
[54]Yang Guolin, Dong Zhigang, Shang GAO, baoyan, Renke Kang, Dongming Guo.A novel reverse helical milling process for reducing push-out delamination of CFRP[J],COMPOSITE STRUCTURES,2022,253
[55]Shang GAO, Dong Zhigang, Renke Kang, Dongming Guo.Design and evaluation of soft abrasive grinding wheels for silicon wafers[J],PROCEEDINGS OF THE INSTITUTION OF MECHANICAL ENGINEERS PART B JOURNAL OF EN,2022,227(B4):578-586
[56]Wu, Y. Q., Shang GAO, Renke Kang, Hao Huang.Deformation patterns and fracture stress of beta-phase gallium oxide single crystal obtained us...[J],JOURNAL OF MATERIALS SCIENCE,2022,54(3):1958-1966
[57]Shang GAO, Wu, Yueqin, Renke Kang, Huang, Han.Nanogrinding induced surface and deformation mechanism of single crystal beta-Ga2O3[J],MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING,2022,79:165-170
[58]Dong Zhigang, Shang GAO, Zhou Ping, Renke Kang, Dongming Guo.Grinding performance evaluation of the developed chemo-mechanical grinding (CMG) tools for sapphi...[J],Advanced materials research,2022,565:105-110
[59]Liu, Zhiqiang, Renke Kang, Haijun, Dong Zhigang, baoyan, Shang GAO, zhuxianglong.FEM-based optimization approach to machining strategy for thin-walled parts made of hard and br...[J],INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY,2022,110(5-6):1399-1413
[60]zhuxianglong, yuli, Dong Zhigang, Renke Kang, Shang GAO, Li, Liansheng.Grinding Marks in Back Grinding of Wafer with Outer Rim[J],PROCEEDINGS OF THE INSTITUTION OF MECHANICAL ENGINEERS PART C JOURNAL OF ME,2022,234(16):3195-3206

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